Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

• In this paper, we present the use of thermosetting nano-imprint resists in adhesive wafer bonding. The presented wafer bonding process is suitable for heterogeneous three-dimensional (3D) integration of microelectromechanical systems (MEMS) and integrated circuits (ICs). Detailed adhesive bonding process parameters are presented to achieve void-free, well-defined and uniform wafer bonding interfaces. Experiments have been performed to optimize the thickness control and uniformity of the nano-imprint resist layer in between the bonded wafers. In contrast to established polymer adhesives such as, e.g., BCB, nano-imprint resists as adhesives for wafer-to-wafer bonding are specifically suitable if the adhesive is intended as sacrificial material. This is often the case, e.g., in fabrication of silicon-on-integrated-circuit (SOIC) wafers for 3D integration of MEMS membrane structures on top of IC wafers. Such IC integrated MEMS includes. e.g., micro-mirror arrays, infrared bolometer arrays, resonators, capacitive inertial sensors, pressure sensors and microphones.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

Adhesive wafer bonding

Nano-imprint resist

Polymer

3D IC MEMS

integration

Silicon-on-integrated-circuit

SOIC

nanoimprint lithography

polymer deformation

arrays

thermosets

design

flow

Other electrical engineering, electronics and photonics

Övrig elektroteknik, elektronik och fotonik

Publikations- och innehållstyp

ref (ämneskategori)

art (ämneskategori)