Investigation of pressure dependent thermal contact resistance between silver metallized SiC chip and molybdenum substrate and between molybdenum substrate and bulk copper

• Thermal contact resistances between a silver metallized SiC chip and a Molybdenum substrate and between the Molybdenum substrate and bulk Copper were measured in a heat transfer experiment. An experimental method to separate thermal contact resistances in a multilayer heat transfer path was used to extract the layer-specific contact resistances. The experimental results were compared with theory based calculations and also with 3-D computational fluid dynamics (CFD) simulation results. The results show significant pressure dependence of the thermal contact resistance and the results show higher thermal contact resistance per unit area between the bulk SiC chip and Molybdenum than between Molybdenum and bulk Copper.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

NATURVETENSKAP  -- Data- och informationsvetenskap (hsv//swe)

NATURAL SCIENCES  -- Computer and Information Sciences (hsv//eng)

Nyckelord

DBC substrate

Heat transfer

Molybdenum substrate

Pressure dependence

SiC

Thermal contact resistance

Computation theory

Computational fluid dynamics

Contact resistance

Copper

Metallizing

Molybdenum

Silicon carbide

Silver

Substrates

Thermal conductivity of solids

Computational fluid dynamics simulations

Experimental methods

Per unit

Pressure dependent

Specific contact resistances

Heat resistance

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