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Low-temperature ful...
Low-temperature full wafer adhesive bonding
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- Niklaus, Frank (författare)
- KTH,Signaler, sensorer och system
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Enoksson, Peter (författare)
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Kälvesten, Edvard (författare)
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- Stemme, Göran (författare)
- KTH,Signaler, sensorer och system
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(creator_code:org_t)
- 2001-02-15
- 2001
- Engelska.
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 11:2, s. 100-107
- Relaterad länk:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- We have systematically investigated the influence of different bonding parameters on void formation in a low-temperature adhesive bonding process. As a result of these studies we present guidelines for void free adhesive bonding of 10 cm diameter wafers. We have focused on polymer coatings with layer thicknesses between 1 mum and 18 mum. The tested polymer materials were benzocyclobutene (BCE) from Dow Chemical, a negative photoresist (ULTRA-i 300) and a positive photoresist (S1818) from Shipley, a polyimide (HTR3) from Arch Chemical and two different polyimides (PI2555 and PI2610) from DuPont. The polymer material, the banding pressure and the pre-curing time and temperature for the polymer significantly influence void formation at the bond interface. High bonding pressure and optimum pre-curing times/temperatures counteract void formation. We present the process parameters to achieve void-free bonding with the BCB coating and with the ULTRA-i 300 photoresist coating as adhesive materials. Excellent void-free and strong bonds have been achieved by using BCB as the bonding material which requires a minimum bonding temperature of 180 degreesC.
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- art (ämneskategori)
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