Low Loss High Linearity RF Interposers Enabled by Through-Glass Vias

• This letter reports on a new low-loss and high linearity3-D wafer-level interposer technology enabled by throughglass vias (TGVs) with an inverted via configuration. Theproposed TGV utilizes a tapered via sidewall profile to achievea void-free conformal metal coverage with lower process timeand fewer fabrication steps than a fully filled conventional TGV.Measurement results for a single 100 μm tall TGV show aninsertion loss of 0.014 dB at 10 GHz and a DC resistanceof 28 mΩ. Finally, this letter reports for the first time onnonlinearity measurements of TGVs. Single-tone measurementsshow that the third harmonic level for a coplanar waveguide(CPW) TGV test structure is only 2 dB higher than a referenceCPW through line without TGVs, indicating an overall excellentlinearity performance.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

Through Glass Via (TGV)

Micromachining

Heterogeneous Integration

Low Loss

High Linearity

Publikations- och innehållstyp

ref (ämneskategori)

art (ämneskategori)