The Stresses Around A Partly Microcracked Hole In Certain Ceramic Materials Under Internal-Pressure.

• In the present work we examine the stress field around a hole in certain ceramic materials. The hole is under internal pressure in plane strain conditions. The material behavior is initially isotropic linearly elastic and upon loading develops microcracks. The damage is assumed to be anisotropic and microcracking is believed to take place along preferred orientations. A damaged constitutive law, appropriate for the microcracking assumptions, is used to derive exact results for the stress fields in this particular problem. The present analysis may find applications in the experimental investigation of ceramic materials behaving as anisotropically microcracking solids.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

Nyckelord

Engineering mechanics

Teknisk mekanik

Materials science

Teknisk materialvetenskap

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