Sökning: id:"swepub:oai:DiVA.org:kth-37546" >
Wire-bonded through...
Wire-bonded through-silicon vias with low capacitive substrate coupling
-
- Fischer, Andreas C., 1982- (författare)
- KTH,Mikrosystemteknik
-
- Grange, M. (författare)
- Department of Engineering, Centre for Microsystems Engineering, Lancaster University, Lancaster LA1 4YW, UK
-
- Roxhed, Niclas (författare)
- KTH,Mikrosystemteknik
-
visa fler...
-
- Weerasekera, R. (författare)
- Department of Engineering, Centre for Microsystems Engineering, Lancaster University, Lancaster LA1 4YW, UK
-
- Pamunuwa, D. (författare)
- Department of Engineering, Centre for Microsystems Engineering, Lancaster University, Lancaster LA1 4YW, UK
-
- Stemme, Göran (författare)
- KTH,Mikrosystemteknik
-
- Niklaus, Frank (författare)
- KTH,Mikrosystemteknik
-
visa färre...
-
(creator_code:org_t)
- 2011-07-26
- 2011
- Engelska.
-
Ingår i: Journal of Micromechanics and Microengineering. - : IOP Science. - 0960-1317 .- 1361-6439. ; 21:8, s. 085035-
- Relaterad länk:
-
http://iopscience.io...
-
visa fler...
-
https://kth.diva-por... (primary) (Raw object)
-
http://kth.diva-port...
-
https://urn.kb.se/re...
-
https://doi.org/10.1...
-
visa färre...
Abstract
Ämnesord
Stäng
- Three-dimensional integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies with through-silicon vias (TSVs). They enable the realization of circuits with shorter signal path lengths, smaller packages and lower parasitic capacitances, which results in higher performance and lower costs. This paper presents a novel technique for fabricating TSVs from bonded gold wires. The wires are embedded in a polymer, which acts both as an electrical insulator, resulting in low capacitive coupling toward the substrate and as a buffer for thermo-mechanical stress.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- Other electrical engineering, electronics and photonics
- Övrig elektroteknik, elektronik och fotonik
Publikations- och innehållstyp
- ref (ämneskategori)
- art (ämneskategori)
Hitta via bibliotek
Till lärosätets databas