Novel surface plasmon waveguide for high integration

• A novel surface plasmon waveguide structure is proposed for highly integrated planar lightwave circuits. By etching a small trench through a metallic thin film on a silica substrate, a guided mode with highly confined light fields is realized. The mode properties of the proposed structure are studied. The necessity of using a polymer upper-cladding is discussed. The coupling between two closely positioned waveguides and a 90° bending are also studied numerically. Sharp bending and high integration can be realized with the present surface plasmon waveguide. The proposed structure is easy to fabricate as compared with some other types of surface plasmon waveguides for high integration

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Telekommunikation (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Telecommunications (hsv//eng)

Nyckelord

Cladding (coating); Fabrication; Light transmission; Metallic films

Numerical analysis

Silica

Surface plasmon resonance

Thin film circuits

Thin films

Photonics

Fotonik

Publikations- och innehållstyp

ref (ämneskategori)

art (ämneskategori)