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Microstructure in e...
Microstructure in electrodeposited copper layers, the role of the substrate
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- Rasmussen, A.A. (author)
- Dept. of Mfg. Eng. and Management, Technical University of Denmark, DK-2800 Kgs. Lyngby, Denmark
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- Jensen, Jens A.D. (author)
- Linköpings universitet,Institutionen för fysik, kemi och biologi,Tekniska högskolan
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- Horsewell, A. (author)
- Dept. of Mfg. Eng. and Management, Technical University of Denmark, DK-2800 Kgs. Lyngby, Denmark
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- Somers, M.A.J. (author)
- Dept. of Mfg. Eng. and Management, Technical University of Denmark, DK-2800 Kgs. Lyngby, Denmark
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Dept of Mfg. Eng. and Management, Technical University of Denmark, DK-2800 Kgs. Lyngby, Denmark Institutionen för fysik, kemi och biologi (creator_code:org_t)
- 2001
- 2001
- English.
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In: Electrochimica Acta. - 0013-4686 .- 1873-3859. ; 47:1, s. 67-74
- Related links:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
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- The microstructures of Cu layers, ranging in thickness from 3 to 12 µm, were investigated. The layers were electrodeposited from an acidic copper electrolyte onto two distinct substrate materials important for the micro-components industry: an Au layer with a pronounced <111>-texture, and a nano-crystalline Ni-P layer. The evolutions of surface topography, morphology and crystallographic texture in the layers were investigated with scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction analysis, respectively. Distinct surface topographies were observed for Cu layers deposited on the Au and Ni-P substrates. Deposition onto the Au substrate resulted in a very smooth surface of all Cu layers, whereas the Ni-P substrate caused an irregular surface for 3-µm-thick layers of Cu. The crystallographic texture in the Cu layers in the first few micrometres depended strongly on the crystallographic texture in the substrate. The Cu crystallites inherited the <111>-orientation of the Au substrate, whilst no preferred crystallographic orientation was observed in the Cu crystallites on the nano-crystalline Ni-P substrate. For Cu layers thicker than 3 µm a <110>-fibre texture developed on both the substrates. © 2001 Elsevier Science Ltd. All rights reserved.
Keyword
- Copper plating
- Electrodeposition
- Microstructures
- Textures
- NATURAL SCIENCES
- NATURVETENSKAP
Publication and Content Type
- ref (subject category)
- art (subject category)
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