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Detailed Characteri...
Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
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- Acharya, Sarthak (författare)
- Luleå tekniska universitet,EISLAB,Luleå University of Technology, Sweden;Univ Oulu, Finland
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- Sattar, Shahid (författare)
- Linnéuniversitetet,Institutionen för fysik och elektroteknik (IFE),Avancerade material,Department of Physics & Electrical Engineering, Linnæus University, 39231 Kalmar, Sweden
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- Chouhan, Shailesh Singh (författare)
- Luleå tekniska universitet,EISLAB,Luleå University of Technology, Sweden
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- Delsing, Jerker, 1957- (författare)
- Luleå tekniska universitet,EISLAB,Luleå University of Technology, Sweden
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(creator_code:org_t)
- 2022-03-24
- 2022
- Engelska.
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Ingår i: Processes. - : MDPI. - 2227-9717. ; 10:4
- Relaterad länk:
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https://doi.org/10.3...
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https://lnu.diva-por... (primary) (Raw object)
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https://urn.kb.se/re...
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https://doi.org/10.3...
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Abstract
Ämnesord
Stäng
- To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Bearbetnings-, yt- och fogningsteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Manufacturing, Surface and Joining Technology (hsv//eng)
Nyckelord
- copper metallization
- electronics fabrication
- DFT analysis
- fully additive method
- polymerization
- UV-laser
- SBU-CBM process
- printed electronics
- characterizations
- Electrotechnology
- Elektroteknik alt Electrical engineering
- Cyberfysiska system
Publikations- och innehållstyp
- ref (ämneskategori)
- art (ämneskategori)
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