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Encapsulation metho...
Encapsulation method for smallwireless measurement systems in high temperature environments
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- Johansson, Jonny (author)
- Luleå tekniska universitet,EISLAB
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- Borg, Johan (author)
- Luleå tekniska universitet,EISLAB
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(creator_code:org_t)
- IMAPS-International Microelectronics and Packaging Society, 2016
- 2016
- English.
- Related links:
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https://urn.kb.se/re...
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https://doi.org/10.4...
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Abstract
Subject headings
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- This paper presents an encapsulation concept that enables the construction of small wireless measurement systems that can operate in industrial environments with ambient temperatures of up to 1200°C. To maximize operational time and minimize size, a layer of thermal insulation is combined with water absorbed in a porous material in the core of the device. The simulated operating time before all of the frozen water at 0?C has transformed into steam at 100°C when the ambient temperature of the device was 1200°C is 21 minutes for a sphere with an outer radius of 4 cm. If the outer radius is increased to 10 cm the simulated operating time increases to 125 minutes. Measurements were performed to validate the design. When a sphere with a radius of 4 cm was subjected to an oven temperature of 1200°C the device held the core temperature at or below 101°C for a total of 25 minutes. The time to reach the boiling point of the water was 9 minutes. Thereafter, the temperature was held constant at 100 +/- 1°C for an additional 16 minutes whereafter a rapid rise in temperature took place once all water had evaporated.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- Industrial Electronics
- Industriell elektronik
Publication and Content Type
- ref (subject category)
- kon (subject category)
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