Model-Based Parametric Study of Surface-Breaking Defect Characterization Using Half-Skip Total Focusing Method

• As the demand of structural integrity in manufacturing industries is increasing, the ultrasonic array technique has drawn more attention thanks to its inspection flexibility and versatility. By taking advantage of the possibility of individual triggering of each array element, full matrix capture (FMC) data acquisition strategy has been developed that contains the entire information of an inspection scenario. Total focusing method (TFM) as one of the ultrasonic imaging algorithms, is preferably applied to FMC dataset since it uses all information in FMC to synthetically focus the sound energy at every image pixel in the region of interest. Half-skip TFM (HSTFM) is proposed in multi-mode TFM imaging that involves a backwall reflection wave path, so that the defect profile could be reconstructed for accurate defect characterization. In this paper, a method involving Snell’s law-based wave mode conversion is proposed to account for more reasonable wave propagation time when wave mode conversion happens at backwall reflection in HSTFM. A series of model based simulations (in software simSUNDT) are performed for parametric studies, with the intention of investigating the capability of defect characterization using HSTFM with varying tilt angle and relative position of surface-breaking notch to array probe. The results show that certain TFM modes could help with defect characterization, but the effectiveness is limited with varying defect features. It is inappropriate to address a certain mode for all characterization perspectives but rather a combination, i.e., multi-mode TFM, should be adopted for possible interpretation and characterization of defect features.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Bearbetnings-, yt- och fogningsteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Manufacturing, Surface and Joining Technology (hsv//eng)

NATURVETENSKAP  -- Fysik -- Annan fysik (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences -- Other Physics Topics (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Strömningsmekanik och akustik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Fluid Mechanics and Acoustics (hsv//eng)

NATURVETENSKAP  -- Data- och informationsvetenskap -- Datorseende och robotik (hsv//swe)

NATURAL SCIENCES  -- Computer and Information Sciences -- Computer Vision and Robotics (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Medicinteknik -- Medicinsk bildbehandling (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Medical Engineering -- Medical Image Processing (hsv//eng)

Nyckelord

Ultrasonic array

Defect characterization

Total focusing method

Simulation

simSUNDT

Signalbehandling

Signal Processing

Production Technology

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