Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound

• In the electronic packaging and energy storage sectors, the study of Cu 6 Sn 5 intermetallic compound (IMC) is getting more attention. At temperatures above 186 °C, this IMC exists in a hexagonal closed packed (HCP) crystalline structure. Crystal plasticity finite element simulations are performed on Cu 6 Sn 5 IMC by taking the information about its lattice parameters and direction dependent elastic properties. Three types of models corresponding to deformations in basal, prismatic and pyramidal modes are developed. With the same type of loading in the elastic regime and boundary conditions, the results of the computations reveal the differences in displacement magnitudes among the three model types.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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