Soldering surface mount components on screen printed Ag patterns on paper and Polyimide substrates for hybrid printed electronics

• The development of printed electronics on flexible substrates is increasing rapidly, where the main benefit is large area and low cost. However, the functionality and performance of printed circuits cannot compete with standard silicon based microprocessors or integrated circuits, though the functionality and performance of printed circuits are increasing. Therefore, in this work we investigate the possibilities of using Sn42/Bi57.6/Ag0.4 low-temperature solder paste together with a reflow solder oven and hot air solder iron to mount regular SMD components on screen-printed silver tracks. It was found that it is possible to solder standard Si SMD pack-ages onto screen-printed Ag ink tracks on paper substrate, however, the component bonding strength to Polyimide were not satisfactory. The resistance of the solder joints was found to be no more than 240 mΩ. The bond strength was found to be higher using the manual hot air sol-der iron than the reflow solder oven. Bending tests show that the bonding strength is higher for the hot air soldered components. Reference samples on FR-4 based copper PCB show a bond strength ~10 times higher but we conclude that it is possible to solder regular Si SMD components onto Ag-printed conductors on paper substrate with good results. The process could be used to fabricate hybrid printed electronics on a standard solder process line.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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