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Ultra-shallow junctions formed using microwave annealing

Xu, Peng (author)
Fu, Chaochao (author)
Hu, Cheng (author)
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Zhang, David Wei (author)
Wu, Dongping (author)
Luo, Jun (author)
Zhao, Chao (author)
Zhang, Zhi-Bin (author)
Uppsala universitet,Fasta tillståndets elektronik
Zhang, Shi-Li (author)
Uppsala universitet,Fasta tillståndets elektronik
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 (creator_code:org_t)
AIP Publishing, 2013
2013
English.
In: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 102:12, s. 122114-
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • Microwave annealing is shown to be viable for achieving low thermal budget formation of ultra-shallow junctions. Regrowth of a 10 nm thick amorphous Si layer that is generated during a Ge amorphization process prior to BF2 or As dopant implantation proceeds at rates up to 0.53 nm/min for BF2 and up to 0.33 nm/min for As at 370 degrees C. The fraction of electrical activation for implanted dopants is as high as 13% for BF2 and 32% for As with negligible diffusion at 540 degrees C.

Keyword

Engineering Science with specialization in Electronics
Teknisk fysik med inriktning mot elektronik

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