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Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach
- Mo, Zhimin (author)
-
- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- (creator_code:org_t)
- 2004
- 2004
- English.
- In: Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004). ; December, s. pp 66-71
- Conference paper (peer-reviewed)
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- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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