Fabrication and Characterization of Graphene/polyimide Composite Film

• A flexible graphene and polyimide composite film was designed and fabricated in this study. A polyimide solution was used as an adhesive layer to connect graphene film and polyimide film by hot-pressing. Laser flash thermal analysis method was carried out to evaluate the thermal diffusion coefficient of different thicknesses of the fabricated films at various temperatures. Bending test was carried out to evaluate the stability and reliability of the composite film. Scanning electron microscopy was applied to characterize the cross-section of the composite film before and after the peel test. IR imaging was employed to compare the heat diffusion of the composite film and traditional flexible copper clad laminate. The results show that the composite film has significantly better thermal diffusion capacity than traditional flexible copper clad laminate.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Kemiteknik -- Polymerteknologi (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Chemical Engineering -- Polymer Technologies (hsv//eng)

NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)

NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Kompositmaterial och -teknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Composite Science and Engineering (hsv//eng)

Nyckelord

Heat diffusion

Cooling

Graphene film

Polyimide

Flexible circuit board

Publikations- och innehållstyp

kon (ämneskategori)

ref (ämneskategori)