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Experimental study ...
Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
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- Zhang, Yan, 1976 (författare)
- Shanghai University
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- Zhou, Yingjie (författare)
- Shanghai University
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- Fan, Jingyu (författare)
- Shanghai University
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- Jiang, Di, 1983 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Fu, Yifeng, 1984 (författare)
- SHT Smart High-Tech AB
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- Ma, Shiwei (författare)
- Shanghai University
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- ISBN 9781479906758
- 2013
- 2013
- Engelska.
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Ingår i: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781479906758 ; , s. 1085-1088
- Relaterad länk:
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http://dx.doi.org/10...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of the CNT interconnects were measured, and the thermal and humidity test were conducted. In addition, the CNT forests on fine pitch copper lines under various environmental test conditions were observed to evaluate the stability. © 2013 IEEE.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
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Till lärosätets databas
- Av författaren/redakt...
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Zhang, Yan, 1976
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Zhou, Yingjie
-
Fan, Jingyu
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Jiang, Di, 1983
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Fu, Yifeng, 1984
-
Ma, Shiwei
-
visa fler...
-
Liu, Johan, 1960
-
visa färre...
- Om ämnet
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Nanoteknik
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Chalmers tekniska högskola