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The Effects of Grap...
The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
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Huang, Shirong (författare)
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Bao, Jie (författare)
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Wang, N. (författare)
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Yuan, G. (författare)
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Ke, Wei (författare)
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Zhang, Dongsheng (författare)
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Yue, Wang (författare)
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- Fu, Yifeng, 1984 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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Ye, Lilei (författare)
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- Jeppson, Kjell, 1947 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- ISBN 9781509013968
- 2016
- 2016
- Engelska.
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Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. Art no 7583272; Pages 889-892
- Relaterad länk:
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http://dx.doi.org/10...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- Graphene-based films (GBF) were fabricated using a chemical conversion process including graphene oxide (GO) preparation by use of Hummer’s method, graphene oxide reduction using L-ascorbic acid (LAA), and finally film formation by vacuum filtration. GBF is considered as a candidate material for thermal management, i.e. for removing heat from hotspots in power electronic packaging, due to its high thermal conductivity. In this work, the GBF heat spreading performance in 3D TSV packaging was analysed using finite element methods (FEM) implemented in the COMSOL software. Both size effects and the influence of the thermal conductivity of the GBF heat spreader on the thermal performance of the 3D TSV package were evaluated. Furthermore, the size effects of the thermal conductive adhesive (TCA) underfill between the chip and the printed circuit board (PCB) were analysed. The results obtained are critical for proper design of graphene-based lateral heat spreaders in high power electronic packaging.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Nyckelord
- Thermal performance
- Finite element analysis
- Electronic packaging
- Graphene-based film
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- ref (ämneskategori)
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Huang, Shirong
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Bao, Jie
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Wang, N.
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Yuan, G.
-
Ke, Wei
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Zhang, Dongsheng
-
visa fler...
-
Yue, Wang
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Fu, Yifeng, 1984
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Ye, Lilei
-
Jeppson, Kjell, ...
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Liu, Johan, 1960
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visa färre...
- Om ämnet
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Nanoteknik
- Artiklar i publikationen
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2016 17th Intern ...
- Av lärosätet
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Chalmers tekniska högskola