On-Chip Integrated Solid-State Micro-Supercapacitor

• Following the trend of electronic deviceminiaturization, on-chip integrated solid-state microsupercapcaitors (MS) were fabricated based on vertically aligned carbon nanofibers (VACNFs) as electrode materials and polymeric gel electrolyte as the solid electrolyte. The VACNFs were grown at 390 oC and 550 oC temperature on interdigitated micro-patterns, where the dimensions of the digits were kept the same but the gap between the digits varied from 10-100 micrometers. A maximum capacitance of 1 mF/cm2 and 0.53mF/cm2 (combined footprint area of digits and gaps) were measured for devices with CNFs grown at 390 oC and 20 m gap, for 550 oC and 10 m gap, respectively. Thesecapacitances are an order of magnitude higher than the one for solid dielectric based silicon trenches capacitors. The low temperature MS show an inverse capacitance relation with the gap size whereas high temperature shows random behavior.High characteristic frequencies at 45o phase angle are 114 Hz for 100 m gap and 142 Hz 30 m gap for 390 oC and 550 oC temperatures. A model for the interdigitated capacitors was developed and the results showed that by eliminating the current collector resistances the characteristic frequencies can be increased to 965 Hz and 866 Hz from 67 Hz and 127 Hz for 10 m gap patterns for 390 oC and 550 oC temperatures. The entire fabrication was done using CMOS compatible processes thus enabling integration directly on active CMOS chip.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Nanoteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Nano-technology (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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