Optimized cleaning processes for silicon wafer bonding

• The use of SPFM (H2SO4-H2O2-HF) at low HF concentrations (10-1000 ppm) has been investigated as a pre-cleaning procedure for silicon direct bonding. This cleaning procedure can be tuned to simultaneously give hydrophilic surface properties, ensuring good bondability, and excellent electric properties, crucial for the application of direct bonding in device applications

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

integrated circuit reliability

integrated circuit measurement

surface contamination

integrated circuit testing

optimisation

silicon

wafer bonding

elemental semiconductors

surface cleaning

integrated circuit yield

Publikations- och innehållstyp

kon (ämneskategori)

ref (ämneskategori)