Sökning: id:"swepub:oai:research.chalmers.se:59eb7482-fb37-4454-8ffb-325347b9138e" >
Measuring residual ...
Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
-
- Zhang, Yaqian (författare)
- Technische Universiteit Delft,Delft University of Technology (TU Delft),Delft University of Technology
-
- Du, Leiming (författare)
- Technische Universiteit Delft,Delft University of Technology (TU Delft),Delft University of Technology
-
- Bäcke, Olof, 1984 (författare)
- Chalmers University of Technology
-
visa fler...
-
- Kalbfleisch, Sebastian (författare)
- Lund University,Lunds universitet,MAX IV, NanoMAX,MAX IV, Imaging,MAX IV, Avdelningen för livsvetenskaper,MAX IV-laboratoriet,MAX IV, NanoMAX,MAX IV, Imaging,MAX IV, Life Science division,MAX IV Laboratory
-
- Zhang, Guo Qi (författare)
- Technische Universiteit Delft,Delft University of Technology (TU Delft)
-
- Vollebregt, Sten (författare)
- Technische Universiteit Delft,Delft University of Technology (TU Delft),Delft University of Technology
-
- Hörnqvist Colliander, Magnus, 1979 (författare)
- Chalmers University of Technology
-
- Zhang, Guoqi (författare)
- Delft University of Technology
-
visa färre...
-
(creator_code:org_t)
- 2024
- 2024
- Engelska.
-
Ingår i: Applied Physics Letters. - 0003-6951 .- 1077-3118. ; 124:8
- Relaterad länk:
-
http://dx.doi.org/10... (free)
-
visa fler...
-
https://doi.org/10.1...
-
https://research.cha...
-
https://lup.lub.lu.s...
-
visa färre...
Abstract
Ämnesord
Stäng
- As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to different electromigration conditions. The results suggest that the measured residual stresses in the early stages of electromigration are related to relaxation of stresses caused by thermal expansion mismatch, while a developing current-induced stress leads to reductions in the residual stress after longer test times. These findings not only validate the feasibility of measuring stress in copper lines using nanodiffraction but also highlight the need for a further understanding, particularly through in situ electromigration experiments with x-ray nanodiffraction analysis.
Ämnesord
- NATURVETENSKAP -- Fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Annan materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Other Materials Engineering (hsv//eng)
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
Hitta via bibliotek
Till lärosätets databas