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A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Zhang, Yan, 1976 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Wang, Teng, 1983 (author)
Chalmers tekniska högskola,Chalmers University of Technology
 (creator_code:org_t)
2007
2007
English.
In: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07).
  • Conference paper (peer-reviewed)
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TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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By the author/editor
Liu, Johan, 1960
Zhang, Yan, 1976
Wang, Teng, 1983
About the subject
ENGINEERING AND TECHNOLOGY
ENGINEERING AND ...
and Electrical Engin ...
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Chalmers University of Technology

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