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Mechanical and ther...
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
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- Sun, Shuangxi, 1986 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Chen, Si, 1981 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Luo, Xin, 1983 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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visa fler...
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- Fu, Yifeng, 1984 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Ye, L. (författare)
- SHT Smart High-Tech AB
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- Elsevier BV, 2016
- 2016
- Engelska.
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Ingår i: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 56, s. 129-135
- Relaterad länk:
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http://dx.doi.org/10...
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http://manuscript.el...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
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- This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Nyckelord
- Nano-fiber
- Nano-TIM
- Microelectronic packaging
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
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Till lärosätets databas
- Av författaren/redakt...
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Sun, Shuangxi, 1 ...
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Chen, Si, 1981
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Luo, Xin, 1983
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Fu, Yifeng, 1984
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Ye, L.
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Liu, Johan, 1960
- Om ämnet
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Nanoteknik
- Artiklar i publikationen
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Microelectronics ...
- Av lärosätet
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Chalmers tekniska högskola