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Influence of nano a...
Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application
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- Sitek, J. (författare)
- Instytut Tele-i Radiotechniczny, Warszawa
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- Koscielski, M. (författare)
- Instytut Tele-i Radiotechniczny, Warszawa
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- Zhang, Y. (författare)
- Shanghai University
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- Fan, J. (författare)
- Shanghai University
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- Ma, S. (författare)
- Shanghai University
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- ISBN 9781479947072
- 2014
- 2014
- Engelska.
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Ingår i: 15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014. - 9781479947072 ; :Art. no. 6922625, s. 151-154
- Relaterad länk:
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http://dx.doi.org/10...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- The results of investigations of new compositions of electrically conductive adhesives (ECA) for printed electronics applications with and without nano-additives are presented. The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated, improved composition of the ECA based on primary conclusions. The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints, but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- reliability of interconnects
- Electrically conductive adhesives
- mechanical properties
- printed electronics
- nano additives
Publikations- och innehållstyp
- kon (ämneskategori)
- ref (ämneskategori)
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