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Graphene-based heat...
Graphene-based heat spreading materials for electronics packaging applications
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- Yuan, G. (författare)
- Shanghai University
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- Shan, B. (författare)
- Shanghai University
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- Chen, S. (författare)
- Shanghai University
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- Yang, Y. (författare)
- Shanghai University
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- Bao, Jie (författare)
- Shanghai University
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- Wang, Nan, 1988 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Su, Peng, 1983 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Huang, S. (författare)
- Shanghai University
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- Zhang, Y. (författare)
- Shanghai University
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- Ye, L. (författare)
- SHT Smart High-Tech AB,Shanghai University
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- Liu, Johan, 1960 (författare)
- Shanghai University
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(creator_code:org_t)
- ISBN 9781538630556
- 2017
- 2017
- Engelska.
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 172-174
- Relaterad länk:
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http://dx.doi.org/10...
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https://doi.org/10.1...
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https://research.cha...
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https://research.cha...
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Abstract
Ämnesord
Stäng
- Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.
Ämnesord
- NATURVETENSKAP -- Kemi -- Materialkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Materials Chemistry (hsv//eng)
Nyckelord
- graphene-based electrically conductive adhesive
- electronics packaging
- graphene-based film
- heat spreading materials
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- kon (ämneskategori)
- ref (ämneskategori)
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Till lärosätets databas
- Av författaren/redakt...
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Yuan, G.
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Shan, B.
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Chen, S.
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Yang, Y.
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Bao, Jie
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Wang, Nan, 1988
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visa fler...
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Su, Peng, 1983
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Huang, S.
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Zhang, Y.
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Ye, L.
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Liu, Johan, 1960
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visa färre...
- Om ämnet
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- NATURVETENSKAP
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NATURVETENSKAP
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och Kemi
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och Materialkemi
- Artiklar i publikationen
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2017 IMAPS Nordi ...
- Av lärosätet
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Chalmers tekniska högskola