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1.
  • Andersson, Cristina, 1969-, et al. (författare)
  • Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
  • 2005
  • Ingår i: Materials Science and Engineering. ; A:394, s. 20-27
  • Tidskriftsartikel (refereegranskat)abstract
    • Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37wt%Pb, Sn-3.5wt%Ag, and Sn-4.0wt%Ag-0.5wt%Cu were carried out at room temperature over a wide range of strains (1% 10%). The fatigue results of both bulk and solder joints were compared and the eutectic Sn-37wt%Pb was used for reference. Concerning bulk solders and solder joints, the two lead-free solders displayed better fatigue properties than Sn-37Pb. For all three solder alloys tested, bulk solders showed better fatigue performance than solder joints when subjected to higher strains. The situation was the opposite at lower strains, resulting in bulk solders depicting larger values for the Coffin-Manson fatigue exponent and ductility coefficient compared to solder joints.
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2.
  • Andrae, Anders, 1973-, et al. (författare)
  • Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
  • 2004
  • Ingår i: IEEE Transactions on Electronics Packaging Manufacturing. ; 27:4, s. 233-245
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. The present paper addresses the question whether there is an environmental advantage of using digital enhanced cordless telecommunications (DECT) phones instead of global system for mobile (GSM) phones in offices. This paper also addresses the environmental compatibility of electrochemical pattern replication (ECPR) compared to classical photolithography-based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions and the projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL, respectively. The research method used was probabilistic uncertainty modeling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the electrochemical pattern replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes, having the highest electricity consumption within the system boundaries have been determined. Based on an earlier work, a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. Furthermore, the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if office use is considered. Reasonable uncertainty intervals, used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system, does affect the outcome of calculation of emission of CO2, but not to the degree that conclusions are not valid. Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependencies should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database. More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as system-in-a-package and system-on-a-chip comparisons.
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  • Andersson, Cristina, 1969-, et al. (författare)
  • Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints
  • 2007
  • Ingår i: Microelectronics Reliability. - 0026-2714. ; 47:2-3, s. 266-272
  • Tidskriftsartikel (refereegranskat)abstract
    • Temperature cycling of a test board with different electronic components was carried out at two different temperature profiles in a single-chamber climate cabinet. The first temperature profile ranged between 55 and 100 C and the second between 0 and 100 C. Hole mounted components and secondary side SMD components were wave soldered with an Sn–3.5Ag alloy. Joints of both dual in line(DIL) packages and ceramic chip capacitors were investigated. Crack initiation and propagation was analysed after every 500 cycles. In total, 6500 cycles were run at both temperature profiles and the observations from each profile were compared. For both kinds of components analysed, cracks were first visible for the temperature profile ranging between 55 and 100 C. For this temperature profile, and for DIL packages, cracks were visible already after 500 cycles, whereas for the other temperature profile, cracks initiated between 1000 and 1500 cycles. The cracks observed after 1500 cycles were visibly smaller for the temperature profile ranging between 0 and 100 C, concluding that crack initiation and propagation was slightly slower for this temperature profile. For the chip capacitors, cracks were first visible after 2000 cycles.
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