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Sökning: swepub > Liu Johan 1960

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1.
  • Andersson, Cristina, 1969-, et al. (författare)
  • Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
  • 2005
  • Ingår i: Materials Science and Engineering. ; A:394, s. 20-27
  • Tidskriftsartikel (refereegranskat)abstract
    • Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37wt%Pb, Sn-3.5wt%Ag, and Sn-4.0wt%Ag-0.5wt%Cu were carried out at room temperature over a wide range of strains (1% 10%). The fatigue results of both bulk and solder joints were compared and the eutectic Sn-37wt%Pb was used for reference. Concerning bulk solders and solder joints, the two lead-free solders displayed better fatigue properties than Sn-37Pb. For all three solder alloys tested, bulk solders showed better fatigue performance than solder joints when subjected to higher strains. The situation was the opposite at lower strains, resulting in bulk solders depicting larger values for the Coffin-Manson fatigue exponent and ductility coefficient compared to solder joints.
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  • Fu, Ying, 1964-, et al. (författare)
  • Electron conduction through nano particles in electrically conductive adhesives
  • 2004
  • Ingår i: Micromaterials and Nanomaterials. ; 3, s. 104-109
  • Tidskriftsartikel (refereegranskat)abstract
    • We have studied the electron transmission of an electrically conductive adhesive (ECA) composed of micro-size and nano-size metal fillers. By quantum mechanics, it has been shown that due to the quantization of electron states in the nano particle, energy barriers are formed at interconnects between the microfillers and nano particles. The energy barriers effectively reduce the electron transmission through the nano particles. For an ECA consisting of 50-nm-diameter nano particles, the electron conduction is reduced by a factor of 2, and the time for the electron to transmit through the nano particle is about 100 ps.
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  • Liu, Johan, 1960-, et al. (författare)
  • Conductive adhesives
  • 2004
  • Ingår i: Lead free electronics. - 0-9707174-7-4 ; s. 285-351
  • Bokkapitel (övrigt vetenskapligt)
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