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  • Resultat 1-10 av 468
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  • Jeong, Seung Hee, et al. (författare)
  • Stretchable thermoelectric generators metallized with liquid alloy
  • 2017
  • Ingår i: ACS Applied Materials and Interfaces. - 1944-8244 .- 1944-8252. ; 9:18, s. 15791-15797
  • Tidskriftsartikel (refereegranskat)abstract
    • Conventional thermoelectric generators (TEGs) are normally hard, rigid, and flat. However, most objects have curvy surfaces, which require soft and even stretchable TEGs for maximizing efficiency of thermal energy harvesting. Here, soft and stretchable TEGs using conventional rigid Bi2Te3 pellets metallized with a liquid alloy is reported. The fabrication is implemented by means of a tailored layer-by-layer fabrication process. The STEGs exhibit an output power density of 40.6 mu W/cm(2) at room temperature. The STEGs are operational after being mechanically stretched-and-released more than 1000 times, thanks to the compliant contact between the liquid alloy interconnects and the rigid pellets. The demonstrated interconnect scheme will provide a new route to the development of soft and stretchable energy-harvesting avenues for a variety of emerging electronic applications.
  • Andersson, Cristina, 1969-, et al. (författare)
  • Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
  • 2005
  • Ingår i: Materials Science and Engineering. ; A:394, s. 20-27
  • Tidskriftsartikel (refereegranskat)abstract
    • Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37wt%Pb, Sn-3.5wt%Ag, and Sn-4.0wt%Ag-0.5wt%Cu were carried out at room temperature over a wide range of strains (1% 10%). The fatigue results of both bulk and solder joints were compared and the eutectic Sn-37wt%Pb was used for reference. Concerning bulk solders and solder joints, the two lead-free solders displayed better fatigue properties than Sn-37Pb. For all three solder alloys tested, bulk solders showed better fatigue performance than solder joints when subjected to higher strains. The situation was the opposite at lower strains, resulting in bulk solders depicting larger values for the Coffin-Manson fatigue exponent and ductility coefficient compared to solder joints.
  • Chen, Si, 1981-, et al. (författare)
  • Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material
  • 2013
  • Ingår i: Soldering & Surface Mount Technology. - 0954-0911. ; 25:4, s. 242-250
  • Tidskriftsartikel (refereegranskat)abstract
    • Purpose - The transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials. Design/methodology/approach - The structure of CNFs was confirmed by transmission electron microscopy (TEM). The electrical performance of the vertically aligned carbon nanofibers (VACNFs) joint was measured by four points probe method and compared to conventional lead-free solder Sn3.0Ag0.5Cu, pure indium and silver CA. A shear test was carried out in order to evaluate the mechanical performance of VACNFs joint. After the shear test, the fracture surface was analyzed by scanning electron microscopy and energy dispersive spectroscopy (SEM-EDS). Findings - The results showed a high success rate in the transfer of VACNFs from growth chip to target chip. The Au-coated CNF can be wetted well with melted indium during the transfer and bonding process. In-Au intermetallic compound (IMC) formed on the surface of CNF. The electrical and mechanical performance of VACNFs is comparable to that of the traditional interconnect materials. The fracture surface is located at the interface between VACNFs and chips. The stacked-cone structure of CNF can be confirmed from a cross-section of the break CNF by TEM. Originality/value - Ultra-short VACNFs were grown and first successfully transferred to the target chip using a process which required little pressure, low temperature and short time.
  • Ekstrand, Lisa, 1974-, et al. (författare)
  • Characterization of Thermally Conductive Epoxy Nano Composites
  • 2005
  • Ingår i: 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005. - 978-078039324-0 ; s. 35-39
  • Konferensbidrag (refereegranskat)
  • Fan, Yi, et al. (författare)
  • Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures
  • 2009
  • Ingår i: Microsystem Technologies. - 0946-7076. ; 15:3, s. 375-381
  • Tidskriftsartikel (refereegranskat)abstract
    • Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and electronic structure. In this work, the effects of coolants on heat transfer capability of on-chip cooling with CNTs Micro-fin Architectures was studied, and the two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The results demonstrate that pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.
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