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1.
  • Andrae, Anders, 1973, et al. (författare)
  • Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processes
  • 2004
  • Ingår i: IEEE transactions on electronics packaging manufacturing (Print). - 1521-334X .- 1558-0822. ; 27:4, s. 233-245, s. 206-217
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. The present paper addresses the question whether there is an environmental advantage of using digital enhanced cordless telecommunications (DECT) phones instead of global system for mobile (GSM) phones in offices. This paper also addresses the environmental compatibility of electrochemical pattern replication (ECPR) compared to classical photolithography-based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions and the projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL, respectively. The research method used was probabilistic uncertainty modeling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the electrochemical pattern replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes, having the highest electricity consumption within the system boundaries have been determined. Based on an earlier work, a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. Furthermore, the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if office use is considered. Reasonable uncertainty intervals, used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system, does affect the outcome of calculation of emission of CO2, but not to the degree that conclusions are not valid. Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependencies should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database. More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as system-in-a-package and system-on-a-chip comparisons.
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2.
  • Fu, Yifeng, 1984, et al. (författare)
  • Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
  • 2012
  • Ingår i: Advanced Materials. - : Wiley. - 0935-9648 .- 1521-4095. ; 24:12, s. 1576-1581
  • Tidskriftsartikel (refereegranskat)abstract
    • A template-assisted method that enables the growth of covalently bonded three-dimensional carbon nanotubes (CNTs) originating from graphene at a large scale is demonstrated. Atomic force microscopy-based mechanical tests show that the covalently bonded CNT structure can effectively distribute external loading throughout the network to improve the mechanical strength of the material.
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3.
  • Wang, Teng, 1983, et al. (författare)
  • Through silicon vias filled with planarized carbon nanotube bundles
  • 2009
  • Ingår i: Nanotechnology. - : IOP Publishing. - 0957-4484 .- 1361-6528. ; 20:48
  • Tidskriftsartikel (refereegranskat)abstract
    • The feasibility of using carbon nanotube (CNT) bundles as the fillers of through silicon vias (TSVs) has been demonstrated. CNT bundles are synthesized directly inside TSVs by thermal chemical vapor deposition (TCVD). The growth of CNTs in vias is found to be highly dependent on the geometric dimensions and arrangement patterns of the vias at atmospheric pressure. The CNT-Si structure is planarized by a combined lapping and polishing process to achieve both a high removal rate and a fine surface finish. Electrical tests of the CNT TSVs have been performed and their electrical resistance was found to be in the few hundred ohms range. The reasons for the high electrical resistance have been discussed and possible methods to decrease the electrical resistance have been proposed.
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4.
  • Murugesan, Murali, 1979, et al. (författare)
  • Carbon fiber solder matrix composite for thermal management of high power electronics
  • 2014
  • Ingår i: Journal of Materials Chemistry. - : Royal Society of Chemistry (RSC). - 1364-5501 .- 0959-9428 .- 2050-7534 .- 2050-7526. ; 2:35, s. 7184-7187
  • Tidskriftsartikel (refereegranskat)abstract
    • A carbon fiber based tin–silver–copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of [similar]4 W m−1 K−1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m−1 K−1 in-plane and 20 ± 3 W m−1 K−1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W−1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.
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5.
  • Hansson, Josef, 1991, et al. (författare)
  • Effects of high temperature treatment of carbon nanotube arrays on graphite : Increased crystallinity, anchoring and inter-tube bonding
  • 2020
  • Ingår i: Nanotechnology. - : Institute of Physics Publishing (IOPP). - 0957-4484 .- 1361-6528. ; 31:45
  • Tidskriftsartikel (refereegranskat)abstract
    • Thermal treatment of carbon nanotubes (CNTs) can significantly improve their mechanical, electrical and thermal properties due to reduced defects and increased crystallinity. In this work we investigate the effect of annealing at 3000 degrees C of vertically aligned CNT arrays synthesized by chemical vapor deposition (CVD) on graphite. Raman measurements show a drastically reduced amount of defects and, together with transmission electron microscope (TEM) diffraction measurements, an increased average crystallite size of around 50%, which corresponds to a 124% increase in Young's modulus. We also find a tendency for CNTs to bond to each other with van der Waals (vdW) forces, which causes individual CNTs to closely align with each other. This bonding causes a densification effect on the entire CNT array, which appears at temperatures >1000 degrees C. The densification onset temperature corresponds to the thermal decomposition of oxygen containing functional groups, which otherwise prevents close enough contact for vdW bonding. Finally, the remaining CVD catalyst on the bottom of the CNT array is evaporated during annealing, enabling direct anchoring of the CNTs to the underlying graphite substrate.
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6.
  • Jeong, Seung Hee, et al. (författare)
  • Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment
  • 2015
  • Ingår i: Scientific Reports. - : Springer Science and Business Media LLC. - 2045-2322. ; 5
  • Tidskriftsartikel (refereegranskat)abstract
    • Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.
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7.
  • Jeong, Seung Hee, et al. (författare)
  • Thermal Elastomer Composites for Soft Transducers
  • 2015
  • Ingår i: 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. - : IEEE conference proceedings. - 9781479989553 ; , s. 1873-1876
  • Konferensbidrag (refereegranskat)abstract
    • There is a need for thermal elastomer composites (TEC) which are stretchable, electrically insulating and easily processablefor soft and stretchable sensor or actuator systems as a thermal conductor or heat spreader at an interface or in a package.A novel TEC was made by embedding a gallium based liquid alloy (Galinstan) as a droplet in polydimethylsiloxane (PDMS,Elastosil RT 601) matrix with a high speed mechanical mixing process.
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8.
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9.
  • Carlberg, Björn, 1983, et al. (författare)
  • Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.
  • 2009
  • Ingår i: Biomedical materials (Bristol, England). - : IOP Publishing. - 1748-605X .- 1748-6041. ; 4:4
  • Tidskriftsartikel (refereegranskat)abstract
    • Adult central nervous system (CNS) tissue has a limited capacity to recover after trauma or disease. Hence, tissue engineering scaffolds intended for CNS repair and rehabilitation have been subject to intense research effort. Electrospun porous scaffolds, mimicking the natural three-dimensional environment of the in vivo extracellular matrix (ECM) and providing physical support, have been identified as promising candidates for CNS tissue engineering. The present study demonstrates in vitro culturing and neuronal differentiation of human embryonic stem cells (hESCs) on electrospun fibrous polyurethane scaffolds. Electrospun scaffolds composed of biocompatible polyurethane resin (Desmopan 9370A, Bayer MaterialScience AG) were prepared with a vertical electrospinning setup. Resulting scaffolds, with a thickness of approximately 150 microm, exhibited high porosity (84%) and a bimodal pore size distribution with peaks at 5-6 and 1 microm. The mean fiber diameter was measured to approximately 360 nm with a standard deviation of 80 nm. The undifferentiated hESC line SA002 (Cellartis AB, Göteborg, Sweden) was seeded and cultured on the produced scaffolds and allowed propagation and then differentiation for up to 47 days. Cultivation of hESC on electrospun fibrous scaffolds proved successful and neuronal differentiation was observed via standard immunocytochemistry. The results indicate that predominantly dopaminergic tyrosine hydroxylase (TH) positive neurons are derived in co-culture with fibrous scaffolds, in comparison to reference cultures under the same differentiation conditions displaying large proportions of GFAP positive cell types. Scanning electron micrographs confirm neurite outgrowth and connection to adjacent cells, as well as cell attachment to individual fibers of the fibrous scaffold. Consequently, electrospun polyurethane scaffolds have been proven feasible as a substrate for hESC propagation and neuronal differentiation. The physical interaction between cells and the fibrous scaffold indicates that these scaffolds provide a three-dimensional physical structure; a potential candidate for neural tissue engineering repair and rehabilitation.
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10.
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