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- Murugesan, Murali, 1979, et al.
(author)
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Carbon fiber solder matrix composite for thermal management of high power electronics
- 2014
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In: Journal of Materials Chemistry. - : Royal Society of Chemistry (RSC). - 1364-5501 .- 0959-9428 .- 2050-7534 .- 2050-7526. ; 2:35, s. 7184-7187
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Journal article (peer-reviewed)abstract
- A carbon fiber based tin–silver–copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of [similar]4 W m−1 K−1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m−1 K−1 in-plane and 20 ± 3 W m−1 K−1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W−1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.
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