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Application of two-...
Application of two-dimensional layered hexagonal boron nitride in chip cooling
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- Bao, Jie (author)
- Huangshan University,Shanghai University
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- Zhang, Y. (author)
- Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University
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- Huang, S. (author)
- Shanghai University
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- Sun, Shuangxi, 1986 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Lu, X. (author)
- Shanghai University
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- Fu, Yifeng, 1984 (author)
- SHT Smart High-Tech AB,Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2016
- 2016
- English.
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In: Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. - 1005-0930. ; 24:1, s. 210-217
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Abstract
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- © 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- Boron nitride
- Single layer
- Thermal evaluation chip
- Heat dissipation
Publication and Content Type
- art (subject category)
- ref (subject category)
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Bao, Jie
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Zhang, Y.
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Huang, S.
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Sun, Shuangxi, 1 ...
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Lu, X.
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Fu, Yifeng, 1984
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show more...
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Liu, Johan, 1960
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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Yingyong Jichu y ...
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Chalmers University of Technology