Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

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Andersson, Cristina, 1969 (författare): Chalmers tekniska högskola,Chalmers University of Technology

Liu, L. (författare): Chalmers tekniska högskola,Chalmers University of Technology

Liu, Johan, 1960 (författare): Chalmers tekniska högskola,Chalmers University of Technology

(creator_code:org_t)

ISBN 9781424405527
2006
2006
Engelska.
Ingår i: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. - 9781424405527 ; , s. 152-160

Relaterad länk:: http://dx.doi.org/10...; visa fler...; https://doi.org/10.1...; https://research.cha...; visa färre...

Abstract Ämnesord

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The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224°C. The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better Ultimate Tensile Strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system. © 2006 IEEE.

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