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Inkjet printing tec...
Inkjet printing technology for increasing the I/O density of 3D TSV interposers
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- Khorramdel, Behnam (författare)
- Tammerfors tekniska universitet,Tampere University of Technology
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- Liljeholm, Jessica (författare)
- KTH,Mikro- och nanosystemteknik,Silex Microsystems AB,Kungliga Tekniska Högskolan (KTH),Royal Institute of Technology (KTH)
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- Laurila, Mika-Matti (författare)
- Tammerfors tekniska universitet,Tampere University of Technology
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- Lammi, Toni (författare)
- Tammerfors tekniska universitet,Tampere University of Technology
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- Mårtensson, Gustaf, 1972 (författare)
- Mycronic AB,Chalmers tekniska högskola,Chalmers University of Technology
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- Ebefors, Thorbjörn (författare)
- Silex Microsystems AB
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- Niklaus, Frank, 1971- (författare)
- KTH,Mikro- och nanosystemteknik,Kungliga Tekniska Högskolan (KTH),Royal Institute of Technology (KTH)
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- Mäntysalo, Matti (författare)
- Tammerfors tekniska universitet,Tampere University of Technology
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(creator_code:org_t)
- 2017-04-10
- 2017
- Engelska.
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Ingår i: Microsystems & Nanoengineering. - : Nature Publishing Group. - 2055-7434. ; 3, s. 17002-
- Relaterad länk:
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https://doi.org/10.1...
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https://www.nature.c...
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https://kth.diva-por... (primary) (Raw object)
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https://www.nature.c...
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http://dx.doi.org/10...
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https://research.cha... (primary) (free)
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https://urn.kb.se/re...
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https://doi.org/10.1...
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https://research.cha...
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https://research.cha...
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Abstract
Ämnesord
Stäng
- Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Nyckelord
- heterogeneous three-dimensional (3D) integration; inkjet printing; interposer; microelectromechanical system (MEMS); reliability; super inkjet (SIJ); through silicon via (TSV)
Publikations- och innehållstyp
- ref (ämneskategori)
- art (ämneskategori)
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