Molecular dynamics simulation for the bonding energy of metal-SWNT interface

For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.

Hu, Zhili,1983Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)zhilih (författare)
Ye, L. (författare)
Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (författare)
Chalmers tekniska högskola (creator_code:org_t)

Ingår i:Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, s. 506-5099781457717680

Av författaren/redakt...: Zhang, Y.; Hu, Zhili, 1983; Ye, L.; Liu, Johan, 1960

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