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An overview of carb...
An overview of carbon nanotubes based interconnects for microelectronic packaging
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- Chen, S. (author)
- Shanghai University
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- Shan, B. (author)
- Shanghai University
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- Yang, Y. (author)
- Shanghai University
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- Yuan, G. (author)
- Shanghai University
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- Huang, S. (author)
- Shanghai University
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- Lu, X. (author)
- Shanghai University
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- Zhang, Y. (author)
- Shanghai University
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- Fu, Yifeng, 1984 (author)
- Shanghai University
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Ye, L. (author)
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- ISBN 9781538630556
- 2017
- 2017
- English.
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 113-119
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http://dx.doi.org/10...
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Abstract
Subject headings
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- Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Kompositmaterial och -teknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Composite Science and Engineering (hsv//eng)
Keyword
- Interconnect
- CNTs-Cu nanocomposite
- CNTs based TSVs
- CNTs based bumps
- resistivity
Publication and Content Type
- kon (subject category)
- ref (subject category)
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- By the author/editor
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Chen, S.
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Shan, B.
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Yang, Y.
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Yuan, G.
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Huang, S.
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Lu, X.
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show more...
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Zhang, Y.
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Fu, Yifeng, 1984
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Ye, L.
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Liu, Johan, 1960
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show less...
- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Materials Engine ...
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and Composite Scienc ...
- Articles in the publication
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2017 IMAPS Nordi ...
- By the university
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Chalmers University of Technology