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WFRF:(Lai Zonghe 1948)
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Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive
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- Cao, Liqiang, 1974 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- Cheng, Zhaonian, 1942 (author)
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- Lai, Zonghe, 1948 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- (creator_code:org_t)
- 2005
- 2005
- English.
- In: Proceedings of the 2005 International Conference on Electronics Packaging (ICEP). ; , s. pp48-55
- Conference paper (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- Liu, Johan, 1960
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- Chalmers University of Technology
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