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Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Bao, Jie, 1982 (författare)
Edwards, Michael, 1986 (författare)
Chalmers University of Technology,Chalmers tekniska högskola
Huang, Shirong (författare)
visa fler...
Zhang, Yong, 1982 (författare)
Chalmers University of Technology,Chalmers tekniska högskola
Fu, Yifeng, 1984 (författare)
Chalmers University of Technology,Chalmers tekniska högskola
al, et (författare)
Jeppson, Kjell, 1947 (författare)
Chalmers University of Technology,Chalmers tekniska högskola
Liu, Johan, 1960 (författare)
Chalmers University of Technology,Chalmers tekniska högskola
visa färre...
Ingår i: Journal of Physics D: Applied Physics. - 0022-3727. ; 49:July 2016, s. 265501-
  • Tidskriftsartikel (refereegranskat)
Abstract Ämnesord
  • The need for electrically insulating materials with a high in-plane thermal conductivity for lateral heat spreading applications in electronic devices has intensified studies of layered hexagonal boron nitride (h-BN) films. Due to its physicochemical properties, h-BN can be utilised in power dissipating devices such as an electrically insulating heat spreader material for laterally redistributing the heat from hotspots caused by locally excessive heat flux densities. In this study, two types of boron nitride based heat spreader test structures have been assembled and evaluated for heat dissipation. The test structures separately utilised a few-layer h-BN film with and without graphene enhancement drop coated onto the hotspot test structure. The influence of the h-BN heat spreader films on the temperature distribution across the surface of the hotspot test structure was studied at a range of heat flux densities through the hotspot. It was found that the graphene-enhanced h-BN film reduced the hotspot temperature by about 8–10°C at a 1000 W/cm2 heat flux density, a temperature decrease significantly larger than for h-BN film without graphene enhancement. Finite element simulations of the h-BN film predict that further improvements in heat spreading ability are possible if the thermal contact resistance between the film and test chip are minimised.


electrical insulation
lateral heat spreader
thermal conduction
boron nitride

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