| 1. |
- Ahlberg, Patrik, et al.
(författare)
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Graphene as a Diffusion Barrier in Galinstan-Solid Metal Contacts
- 2014
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Ingår i: IEEE Transactions on Electron Devices. - 0018-9383 .- 1557-9646. ; 61:8, s. 2996-3000
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents the use of graphene as a diffusion barrier to a eutectic Ga-In-Sn alloy, i.e., galinstan, for electrical contacts in electronics. Galinstan is known to be incompatible with many conventional metals used for electrical contacts. When galinstan is in direct contact with Al thin films, Al is readily dissolved leading to the formation of Al oxides present on the surface of the galinstan droplets. This reaction is monitored ex situ using several material analysis methods as well as in situ using a simple circuit to follow the time-dependent resistance variation. In the presence of a multilayer graphene diffusion barrier, the Al-galinstan reaction is effectively prevented for galinstan deposited by means of drop casting. When deposited by spray coating, the high-impact momentum of the galinstan droplets causes damage to the multilayer graphene and the Al-galinstan reaction is observed at some defective spots. Nonetheless, the graphene barrier is likely to block the formation of Al oxides at the Al/galinstan interface leading to a stable electrical current in the test circuit.
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| 2. |
- Andric, Stefan, et al.
(författare)
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Performance, Analysis, and Modeling of III-V Vertical Nanowire MOSFETs on Si at Higher Voltages
- 2022
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Ingår i: IEEE Transactions on Electron Devices. - 0018-9383. ; 69:6, s. 3055-3055
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Tidskriftsartikel (refereegranskat)abstract
- Heterostructure engineering in III-V vertical nanowire (VNW) MOSFETs enables tuning of transconductance and breakdown voltage. In this work, an InxGa 1−x As channel with a Ga-composition grading ( x= 1–0.4) in the channel and drain region, combined with field plate engineering, enables breakdown voltage above 2.5 V, while maintaining transconductance of about 1 mS/ μm , in VNW MOSFETs. The field plate consists of a vertically integrated SiO2 layer and a gate contact, which screens the electric field in the drain region, extending the device operating voltage. By scaling the field plate, a transconductance of 2 mS/ μm , alongside the breakdown voltage of 1.5 V, is obtained, demonstrating the benefit of field engineering in the drain. The scalability of the field plate and the gate is measured, showing an ON-resistance increase by 23 Ω⋅μm , and transconductance decrease by 5 μS/μm , per nm field plate length. This behavior is captured in a new and modified virtual source model, where device transmission and drain resistance are altered to capture the field plate scaling effect. The modeling is applied to nanowire (NW) devices with field plate lengths ranging from 5 to 115 nm, capturing accurately essential device performance parameters. Finally, a modified band-to-band (BTB) tunneling approach is used to accurately describe the device behavior above 1.5 V.
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| 3. |
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| 4. |
- Asad, Muhammad, 1986, et al.
(författare)
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Enhanced high-frequency performance of top-gated graphene FETs due to substrate-induced improvements in charge carrier saturation velocity
- 2021
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Ingår i: IEEE Transactions on Electron Devices. - 1557-9646 .- 0018-9383. ; 68:2, s. 899-902
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Tidskriftsartikel (refereegranskat)abstract
- High-frequency performance of top-gated graphene field-effect transistors (GFETs) depends to a large extent on the saturation velocity of the charge car-riers, a velocity limited by inelastic scattering by surface optical phonons from the dielectrics surrounding the chan-nel. In this work, we show that by simply changing the graphene channel surrounding dielectric with a material having higher optical phonon energy, one could improve the transit frequency and maximum frequency of oscillation of GFETs. We fabricated GFETs on conventional SiO2/Si substrates by adding a thin Al2O3 interfacial buffer layer on top of SiO2/Si substrates, a material with about 30% higher optical phonon energy than that of SiO2, and compared performance with that of GFETs fabricated without adding the interfacial layer. From S-parameter measurements, a transit frequency and a maximum frequency of oscillation of 43 GHz and 46 GHz, respectively, were obtained for GFETs on Al2O3 with 0.5 µm gate length. These values are approximately 30% higher than those for state-of-the-art GFETs of the same gate length on SiO2. For relating the improvement of GFET high-frequency performance to improvements in the charge carrier saturation velocity, we used standard methods to extract the charge carrier veloc-ity from the channel transit time. A comparison between two sets of GFETs with and without the interfacial Al2O3 layer showed that the charge carrier saturation velocity had increased to 2·10^7 cm/s from 1.5·10^7 cm/s.
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| 5. |
- Athle, Robin, et al.
(författare)
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Impact of Temperature-Induced Oxide Defects on HfxZr1−xO2 Ferroelectric Tunnel Junction Memristor Performance
- 2023
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Ingår i: IEEE Transactions on Electron Devices. - 0018-9383. ; 70:3, s. 1412-1416
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Tidskriftsartikel (refereegranskat)abstract
- In this work, we evaluate the importance of the postmetallization annealing (PMA) temperature on the performance of HfxZr1−xO2-based ferroelectric tunnel junctions (FTJs). Our results indicate a significant difference in tunneling electroresistance (TER) ratio and endurance, depending on the PMA temperature despite negligible variations in remanent polarization. We conclude that the minimization of conductive oxide defect states is central to achieve high performance. Through carefully optimized PMA conditions, we demonstrate FTJs with a TER = 3 and low mean cycle-to-cycle variation of < 1.5% combined with at least 16 separable conductance states providing a 4-bit resolution analog FTJ.
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| 6. |
- Axelsson, Olle, 1986, et al.
(författare)
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Application Relevant Evaluation of Trapping Effects in AlGaN/GaN HEMTs With Fe-Doped Buffer
- 2016
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Ingår i: IEEE Transactions on Electron Devices. - 1557-9646 .- 0018-9383. ; 63:1, s. 326-332
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Tidskriftsartikel (refereegranskat)abstract
- This paper investigates the impact of different iron (Fe) buffer doping profiles on trapping effects in microwave AlGaN/gallium nitride (GaN) high electron mobility transistors (HEMTs). We characterize not only the current collapse due to trapping in the buffer, but also the recovery process, which is important in the analysis of suitable linearization schemes for amplitude modulated signals. It is shown that the simple pulsed dc measurements of current transients can be used to investigate transient effects in the RF power. Specifically, it is revealed that the design of the Fe-doping profile in the buffer greatly influences the recovery time, with the samples with lower Fe concentration showing slower recovery. In contrast, traditional indicators, such as S-parameters and dc as well as pulsed $I$-$V$ characteristics, show very small differences. An analysis of the recovery shows that this effect is due to the presence of two different detrapping processes with the same activation energy (0.6 eV) but different time constants. For highly doped buffers, the faster process dominates, whereas the slower process is enhanced for less doped buffers.
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| 7. |
- Baikov, Andrey Yu., et al.
(författare)
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Toward High-Power Klystrons With RF Power Conversion Efficiency on the Order of 90%
- 2015
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Ingår i: IEEE Transactions on Electron Devices. - 0018-9383. ; 62:10, s. 3406-3412
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Tidskriftsartikel (refereegranskat)abstract
- The increase in efficiency of RF power generation for future large accelerators is considered a high priority issue. The vast majority of the existing commercial high-power RF klystrons operates in the electronic efficiency range between 40% and 55%. Only a few klystrons available on the market are capable of operating with 65% efficiency or above. In this paper, a new method to achieve 90% RF power conversion efficiency in a klystron amplifier is presented. The essential part of this method is a new bunching technique-bunching with bunch core oscillations. Computer simulations confirm that the RF production efficiency above 90% can be reached with this new bunching method. The results of a preliminary study of an L-band, 20-MW peak RF power multibeam klystron for Compact Linear Collider with the efficiency above 85% are presented.
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| 8. |
- Bakowski, Mietek, et al.
(författare)
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Design and characterization of newly developed 10 kV 2 A SiC p-i-n diode for soft-switching industrial power supply
- 2015
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Ingår i: IEEE Transactions on Electron Devices. - : Institute of Electrical and Electronics Engineers Inc.. - 0018-9383 .- 1557-9646. ; 62:2, s. 366-373
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Tidskriftsartikel (refereegranskat)abstract
- 10 kV, 2 A SiC p-i-n diodes have been designed and fabricated. The devices feature excellent stability of forward characteristics and robust junction termination with avalanche capability of 1 J. The fabricated diodes have been electrically evaluated with respect to dynamic ON-state voltage, reverse recovery behavior, bipolar stability, and avalanche capability. More than 60% reduction of losses has been demonstrated using newly developed 10-kV p-i-n diodes in a multikilowatt high voltage, high-frequency dc/dc soft-switching converter
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| 9. |
- Bengtsson, Olof, et al.
(författare)
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Investigation of SOI-LDMOS for RF-power applications using Computational Load-Pull
- 2009
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Ingår i: IEEE Transactions on Electron Devices. - : IEEE. - 0018-9383 .- 1557-9646. ; 56:3, s. 505-511
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Tidskriftsartikel (refereegranskat)abstract
- Small-signal and computational load-pull simulations are used to investigate the effect of substrate resistivity on efficiency in high-power operation of high-frequency silicon-on-insulator-LDMOS transistors. Identical transistors are studied on substrates with different resistivities. Using computational load pull, their high-power performance is evaluated. The results are compared to previous investigations, relating the OFF-state output resistance to high-efficiency operation. From the large-signal simulation, an output circuit model based on a load-line match is extracted with parameters traceable from small-signal simulations. It is shown that, albeit high OFF-state output resistance is a good indication, it is not sufficient for high efficiency in a high-power operation. The bias and frequency dependence of the coupling through the substrate makes a more detailed ON-state analysis necessary. It is shown that very low resistivity and high-resistivity SOI substrates both result in a high efficiency at the studied frequency and bias point. It is also shown that a normally doped medium-resistivity substrate results in a significantly lower efficiency.
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| 10. |
- Bergsten, Johan, 1988, et al.
(författare)
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Electron Trapping in Extended Defects in Microwave AlGaN/GaN HEMTs with Carbon-Doped Buffers
- 2018
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Ingår i: IEEE Transactions on Electron Devices. - : IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC. - 1557-9646 .- 0018-9383. ; 65:6, s. 2446-2453
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Tidskriftsartikel (refereegranskat)abstract
- This paper investigates AlGaN/GaN high-electron mobility transistors (HEMTs) fabricated on epistructures with carbon (C)-doped buffers. Metalorganic chemical vapor deposition is used to grow two C-doped structures with different doping profiles, using growth parameters to change the C incorporation. The C concentration is low enough to result in n-type GaN. Reference devices are also fabricated on a structure using iron (Fe) as dopant, to exclude any process related variations and provide a relevant benchmark. All devices exhibit similar dc performance. However, pulsed I - V$ measurements show extensive dispersion in the C-doped devices, with values of dynamic R-mathrm-scriptscriptstyle ON 3 -4 times larger than in the dc case. Due to the extensive trapping, the devices with C-doped buffers can only supply about half the output power of the Fe-doped sample, 2.5 W/mm compared to 4.8 W/mm at 10 GHz. In drain current transient measurements, the trap filling time is varied, finding large prevalence of trapping at dislocations for the C-doped samples. Clusters of C around the dislocations are suggested to be the main cause for the increased dispersion.
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