| 1. |
- Brinkfeldt, Klas, et al.
(författare)
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Microshutters for MEMS-based time-of-flight measurements in space
- 2011
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. - 9781424496327 ; , s. 597-600
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Konferensbidrag (refereegranskat)abstract
- This paper reports on the fabrication, integration and first operation of a mechanical microshutter in a time-of-flight (TOF) based ion detector in space. The microshutter is fabricated from a silicon on insulator (SOI) wafer and operated in a resonance mode, 306 kHz. Open time of the shutter is 100 ns. The microshutters are integrated in the PRIMA instrument, which is part of the payload on the Swedish PRISMA mission. PRISMA was successfully launched into low Earth orbit on June 15, 2010.
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| 2. |
- Brugger, J., et al.
(författare)
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Letter from the chairs
- 2015
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Ingår i: IEEE International Conference on Micro Electro Mechanical Systems. - : IEEE conference proceedings. - 1084-6999. ; 2015-February:February
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Tidskriftsartikel (refereegranskat)
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| 3. |
- Dahmardeh, M., et al.
(författare)
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High-aspect-ratio, 3-D micromachining of carbon-nanotube forests by micro-electro-discharge machining in air
- 2011
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. - 9781424496327 ; , s. 272-275
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- This paper reports micro-electro-discharge machining of vertically aligned carbon nanotube forests for the formation of high-aspect-ratio, three-dimensional microstructures in the material. The developed forest machining method is a dry process performed in air, generating high-frequency pulses of electrical discharge to locally machine the nanotubes in order to create target shapes in a forest. With this approach, forest microstructures can be fabricated to have varying shapes along their height, unachievable with conventional pre-patterned chemical vapor deposition growth techniques. The use of the pulses with a minimized discharge energy defined with 35 V and 10 pF in the discharge generation circuit leads to an aspect ratio of 20 with the smallest feature of 5 μm in forests without disordering the vertical orientation of the nanotubes. Micromachining of multilayer geometries as well as arrayed needle-like microstructures with angled surfaces is demonstrated.
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| 4. |
- Feng, P., et al.
(författare)
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MEMS 2021 Welcome
- 2021
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Ingår i: IEEE International Conference on Micro Electro Mechanical Systems. - : Institute of Electrical and Electronics Engineers Inc.. - 1084-6999. ; 2021-January, s. i-ii
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Tidskriftsartikel (refereegranskat)
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| 5. |
- Mandon, J., et al.
(författare)
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A photonic microsystem for hydrocarbon gas analysis by mid-infrared absorption spectroscopy
- 2017
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. ; , s. 1052-1055
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Konferensbidrag (refereegranskat)abstract
- This paper demonstrates the functional integration of a linear variable optical filter (LVOF) and a gas cell at the wafer level, i.e. a gas-filled LVOF, where the resonator cavity of the filter is also used for storing the gas sample. A mm-level effective optical absorption path length is achieved from a μm-level physical path length, by exploiting multiple reflections from highly reflective Bragg mirrors and the high-order operation of the filter. The wideband spectral response of the device is ensured by using a tapered cavity, where the cavity length changes linearly along the length of the filter. Therefore, combined with a detector array and a light source, the gas-filled LVOF enables wideband operation and long absorption path in a single MEMS device, thus ensuring a highly sensitive on-chip gas absorption microspectrometer.
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| 6. |
- Nafari, Alexandra, 1980, et al.
(författare)
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MEMS sensor for in situ TEM Atomic Force Microscopy
- 2007
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Ingår i: IEEE 20th International Conference on Micro Electro Mechanical Systems, 2007. MEMS. - 1084-6999. ; , s. 103-106
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Konferensbidrag (refereegranskat)abstract
- AbstractHere we present a MEMS atomic force microscope (AFM) sensor for use inside a transmission electron microscope (TEM). This enables direct in situ TEM force measurements in the nN range. The main design challenges of the sensor are a high sensitivity and the narrow dimensions of the pole gap inside the TEM. Fabrication of the sensor was done using standard micromachining techniques, such as ion implantation, oxide growth and deep reactive ion etch. We present in situ TEM force measurements on nanotubes, which demonstrates the ability to measure spring constants of nanoscale systems.
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| 7. |
- Rahiminejad, Sofia, 1987, et al.
(författare)
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Rapid manufacturing of OSTE polymer RF-MEMS components
- 2017
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - : IEEE. - 1084-6999. - 9781509050789 ; , s. 901-904
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Konferensbidrag (refereegranskat)abstract
- This paper reports the first RF-MEMS component in OSTE polymer. Three OSTE-based ridge gap resonators were fabricated by direct, high aspect ratio, photostructuring. The OSTE polymer's good adhesion to gold makes it suitable for RF-MEMS applications. The OSTE ridge gap resonators differ in how they were coated with gold. The OSTE-based devices are compared to each other as well as to Si-based, SU8-based, and CNT-based devices of equal design. The OSTE-based process was performed outside the cleanroom, and with a fast fabrication process (∼1 h). The OSTE-based device performance is on par with that of the other alternatives in terms of frequency, attenuation, and Q-factor.
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| 8. |
- Sharma, Kirti, et al.
(författare)
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New Wafer-Level Fabrication of Ultrathin Silicon Insertion Shuttles for Flexible Neural Implants
- 2023
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. ; 2023-January, s. 421-424
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Konferensbidrag (refereegranskat)abstract
- This paper reports a novel, cost-effective process for the fabrication of ultrathin silicon (Si) shuttles applied as insertion tools for highly flexible polyimide (PI) neural implants. The process exploits the so-called etching before grinding (EBG) process established to realize Si-based neural probes of the Michigan style. In this study, EBG is combined for the first time with a subsequent deep reactive ion etch (DRIE) process applied on the wafer-level. The innovative approach allows to realize insertion shuttles with a base thickness > 50 μm using wafer grinding and to reliably thin down the slender shuttle shanks (width ≥ 35 μm) to thicknesses as small as 15 μm using DRIE. The backgrinding liquid wax applied during wafer grinding enables the safe release of the delicate shuttle structures from their carrier wafer using isopropanol. Flexible, 15-μm-thin neural probes made from PI are precisely aligned and temporarily bonded to the custom-designed insertion shuttles applying polyethylene glycol (PEG) and reliably deployed into cortical tissue.
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