| 1. |
- Brinkfeldt, Klas, et al.
(författare)
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Microshutters for MEMS-based time-of-flight measurements in space
- 2011
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. - 9781424496327 ; , s. 597-600
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Konferensbidrag (refereegranskat)abstract
- This paper reports on the fabrication, integration and first operation of a mechanical microshutter in a time-of-flight (TOF) based ion detector in space. The microshutter is fabricated from a silicon on insulator (SOI) wafer and operated in a resonance mode, 306 kHz. Open time of the shutter is 100 ns. The microshutters are integrated in the PRIMA instrument, which is part of the payload on the Swedish PRISMA mission. PRISMA was successfully launched into low Earth orbit on June 15, 2010.
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| 2. |
- Dahmardeh, M., et al.
(författare)
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High-aspect-ratio, 3-D micromachining of carbon-nanotube forests by micro-electro-discharge machining in air
- 2011
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. - 9781424496327 ; , s. 272-275
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- This paper reports micro-electro-discharge machining of vertically aligned carbon nanotube forests for the formation of high-aspect-ratio, three-dimensional microstructures in the material. The developed forest machining method is a dry process performed in air, generating high-frequency pulses of electrical discharge to locally machine the nanotubes in order to create target shapes in a forest. With this approach, forest microstructures can be fabricated to have varying shapes along their height, unachievable with conventional pre-patterned chemical vapor deposition growth techniques. The use of the pulses with a minimized discharge energy defined with 35 V and 10 pF in the discharge generation circuit leads to an aspect ratio of 20 with the smallest feature of 5 μm in forests without disordering the vertical orientation of the nanotubes. Micromachining of multilayer geometries as well as arrayed needle-like microstructures with angled surfaces is demonstrated.
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| 3. |
- Brugger, J., et al.
(författare)
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Letter from the chairs
- 2015
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Ingår i: IEEE International Conference on Micro Electro Mechanical Systems. - : IEEE conference proceedings. - 1084-6999. ; 2015-February:February
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Tidskriftsartikel (refereegranskat)
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| 4. |
- Clausi, Donato, et al.
(författare)
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WAFER-LEVEL MECHANICAL AND ELECTRICAL INTEGRATION OF SMA WIRES TO SILICON MEMS USING ELECTROPLATING
- 2011
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Ingår i: 24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2011). - : IEEE conference proceedings. - 9781424496327 ; , s. 1281-1284
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Konferensbidrag (refereegranskat)abstract
- This paper reports on the wafer-level fixation and electrical connection of pre-strained SMA wires on silicon MEMS using electroplating, providing high bond strength and electrical connections in one processing step. The integration method is based on standard micromachining techniques, and it potentially allows mass production of microactuators having high work density. SEM observation showed an intimate interconnection between the SMA wire and the silicon substrate, and destructive testing performed with a shear tester showed a bond strength exceeding 1 N. The first Joule-heated SMA wire actuators on silicon were fabricated and their performance evaluated. Measurements on a 4.5 x 1.8 mm2 footprint device show a 460 μm stroke at low power consumption (70 mW).
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| 5. |
- Feng, P., et al.
(författare)
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MEMS 2021 Welcome
- 2021
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Ingår i: IEEE International Conference on Micro Electro Mechanical Systems. - : Institute of Electrical and Electronics Engineers Inc.. - 1084-6999. ; 2021-January, s. i-ii
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Tidskriftsartikel (refereegranskat)
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| 6. |
- Fischer, Andreas C., et al.
(författare)
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Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires
- 2011
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Ingår i: Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. - : IEEE. - 9781424496327 ; , s. 37-40
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Konferensbidrag (refereegranskat)abstract
- Three-dimensional (3D) integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies using through silicon vias (TSVs). They enable the realization of devices with shorter signal lengths, smaller packages and lower parasitic capacitances, which can result in higher performance and lower costs of the system. This paper presents a novel low-cost fabrication technique for solid metal-filled TSVs using nickel wires as conductive path. The wires are placed in the via hole of a silicon wafer by magnetic self-assembly. This metal filling technique enables through-wafer vias with high aspect ratios and potentially eliminates characteristic cost drivers of the TSV production such as metallization processes, wafer thinning and general issues associated with thin-wafer handling.
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| 7. |
- Mandon, J., et al.
(författare)
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A photonic microsystem for hydrocarbon gas analysis by mid-infrared absorption spectroscopy
- 2017
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. ; , s. 1052-1055
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Konferensbidrag (refereegranskat)abstract
- This paper demonstrates the functional integration of a linear variable optical filter (LVOF) and a gas cell at the wafer level, i.e. a gas-filled LVOF, where the resonator cavity of the filter is also used for storing the gas sample. A mm-level effective optical absorption path length is achieved from a μm-level physical path length, by exploiting multiple reflections from highly reflective Bragg mirrors and the high-order operation of the filter. The wideband spectral response of the device is ensured by using a tapered cavity, where the cavity length changes linearly along the length of the filter. Therefore, combined with a detector array and a light source, the gas-filled LVOF enables wideband operation and long absorption path in a single MEMS device, thus ensuring a highly sensitive on-chip gas absorption microspectrometer.
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| 8. |
- Nafari, Alexandra, 1980, et al.
(författare)
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MEMS sensor for in situ TEM Atomic Force Microscopy
- 2007
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Ingår i: IEEE 20th International Conference on Micro Electro Mechanical Systems, 2007. MEMS. - 1084-6999. ; , s. 103-106
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Konferensbidrag (refereegranskat)abstract
- AbstractHere we present a MEMS atomic force microscope (AFM) sensor for use inside a transmission electron microscope (TEM). This enables direct in situ TEM force measurements in the nN range. The main design challenges of the sensor are a high sensitivity and the narrow dimensions of the pole gap inside the TEM. Fabrication of the sensor was done using standard micromachining techniques, such as ion implantation, oxide growth and deep reactive ion etch. We present in situ TEM force measurements on nanotubes, which demonstrates the ability to measure spring constants of nanoscale systems.
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| 9. |
- Rahiminejad, Sofia, 1987, et al.
(författare)
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Rapid manufacturing of OSTE polymer RF-MEMS components
- 2017
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - : IEEE. - 1084-6999. - 9781509050789 ; , s. 901-904
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Konferensbidrag (refereegranskat)abstract
- This paper reports the first RF-MEMS component in OSTE polymer. Three OSTE-based ridge gap resonators were fabricated by direct, high aspect ratio, photostructuring. The OSTE polymer's good adhesion to gold makes it suitable for RF-MEMS applications. The OSTE ridge gap resonators differ in how they were coated with gold. The OSTE-based devices are compared to each other as well as to Si-based, SU8-based, and CNT-based devices of equal design. The OSTE-based process was performed outside the cleanroom, and with a fast fabrication process (∼1 h). The OSTE-based device performance is on par with that of the other alternatives in terms of frequency, attenuation, and Q-factor.
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| 10. |
- Shah, Umer, et al.
(författare)
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MULTI-POSITION LARGE TUNING-RANGE DIGITALLY TUNEABLE CAPACITORS EMBEDDED IN 3D MICROMACHINED TRANSMISSION LINES
- 2011
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Ingår i: IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011. - : IEEE. - 9781424496327 ; , s. 165-168
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Konferensbidrag (refereegranskat)abstract
- This paper reports for the first time on multi-position RF MEMS digitally tuneable capacitors with large tuning range which are integrated inside a coplanar transmission line and whose tuning is achieved by moving the sidewalls of the 3D micromachined transmission line, with the actuators being completely embedded and shielded inside the ground layer. Devices with symmetrical two and three stage actuators have been fabricated in an SOI RF MEMS process. A tuning range of Cmax/Cmin=2.41 with a total of 7 discrete tuning steps from 44 to 106 fF was achieved for the three-stage tuneable capacitors. The symmetrical integration in the transmission line and a low parasitic inductance result in a high resonance frequency of 77 GHz. Devices with actuator designs of different mechanical stiffness, resulting in actuation voltages of 16 to 73 V, were fabricated and evaluated. The robustness of the actuator to high-power signals has been investigated by a nonlinear electromechanical model, which shows that self actuation occurs for high-stiffness designs (73 N/m) not below 50 dBm, and even very low-stiffness devices (9.5 N/m) do not self-actuate below 40 dBm.
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