| 1. |
- Fredriksson, Henrik, et al.
(författare)
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Improvement Potential and Equalization Example for Multidrop DRAM Memory Buses
- 2009
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Ingår i: IEEE TRANSACTIONS ON ADVANCED PACKAGING. - 1521-3323. ; 32:3, s. 675-682
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Tidskriftsartikel (refereegranskat)abstract
- For PC DRAM memory buses, the number of slots per channel have been decreased as signal frequencies increase. This limits the data capacity per channel. In this paper, we show that the slot reduction is not due to fundamental limits of the channel structure but due to signaling schemes. An equalization scheme is presented which enables higher bit-rates with minimum modification of bus structure and memory circuits. The circuitry added to the host side of the bus has reasonable complexity and features very low latency. Measurements of memory-to-host transmissions over a four-drop-bus at 2.6 Gb/s using a 0.13 mu m CMOS test-circuit is presented.
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| 2. |
- Hesselblom, Hjalmar, et al.
(författare)
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Very High Density Interconnect Elastomer Chip Sockets
- 2006
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 29:2, s. 202-210
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Tidskriftsartikel (refereegranskat)abstract
- The integration of more and more functionality into smaller and smaller form factor electronic products, drives the need for denser chip to substrate interconnect systems. As the number of I/O pins increases, the use of area array chips or packages becomes inevitable. Metal patterned elastomer chip sockets have now been improved to work with contact densities as high as 80000 contacts/cm(2) corresponding to a pitch of 36 mu m. Sockets with 10000 contacts and a 72-mu m pitch have survived more than 400 cycles in air-to-air thermal cycling chambers as well as freezing shocks caused by dipping into liquid nitrogen. Although the daisy chain test circuits breaks for temperatures lower than -50 degrees C and higher than 90 degrees C, they always return to the initial resistance values when entering the normal temperature range. The combination of a gold-to-gold contact interface and the elastic features of the contact bumps makes this socket an ideal compliance layer between bare chips and different types of carrier substrates, reducing the problems caused by thermomechanical mismatch between the substrate and the chip. Bad dies can easily be replaced, since the chip is not soldered or glued to the socket. The size and the possibility to control the geometry of the contacts provides means to maintain a good high-frequency characteristic impedance matching all the way to the chip pad.
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| 3. |
- Hsu, L. H., et al.
(författare)
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Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications
- 2010
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323. ; 33:1, s. 30-36
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents the parametric study of RF-via (0-level) and flip-chip bump (1-level) transitions for applications of packaging coplanar RF-MEMS devices. The key parameters were found to be the bumps' and vias' positions and the overlap of the metal pads, which should be carefully considered in the entire two levels of packages. The length of the backside transmission line, determining the MEMS substrate area, showed minor influence on the interconnect performance. With the experimental results, the design rules have been developed and established. The optimized interconnect structure for the two levels of packages demonstrates the return loss beyond 15 dB and the insertion loss within 0.6 dB from dc to 60 GHz.
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| 4. |
- Johansson, Christian, et al.
(författare)
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Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates
- 2003
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 26:1, s. 81-89
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Tidskriftsartikel (refereegranskat)abstract
- Requirements of higher performance, reduced size, weight and cost of high-frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also of interest are integrated packaging solutions for high frequency electrical packaging and optical interconnects and packaging. Sequentially build up multi-layers have been deposited on a low cost FR-4 epoxy substrate. The dielectric layers consist of a photo-patternable inorganic-organic hybrid polymer (ORMOCER) and the metallization is Cu. An UV-exposure equipment enabling projection patterning with 5 μm resolution have been used. The produced microstrip lines, ring resonators, vias, stacked capacitors and filters have been characterized at frequencies from 1 to 40 GHz showing the potential of the new dielectric materials and processing technologies for microwave applications.
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| 5. |
- Karlsson, Magnus, et al.
(författare)
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A Frequency Triplexer for Ultra-wideband Systems Utilizing Combined Broadside- and Edge-coupled Filters
- 2008
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 31:4, s. 794-801
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Tidskriftsartikel (refereegranskat)abstract
- A fully integrated triplexer for multiband ultra-wideband radio is presented. The triplexer utilizes a microstrip network and three combined broadside- and edge-coupled filters. It is fully integrated in a printed circuit board with low requirements on the printed circuit board process tolerance. Three flat subbands in the frequency band 3.1-4.8 GHz have been achieved. The group delay variation within each 500-MHz subband was measured to be around 1 ns. A good agreement between simulation and measurement was obtained.
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| 6. |
- Mansson, A, et al.
(författare)
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Actin-based molecular motors for cargo transportation in nanotechnology - Potentials and challenges
- 2005
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323. ; 28:4, s. 547-555
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Tidskriftsartikel (refereegranskat)abstract
- Here, we review the use of actin-based motors, (myosins; e.g., the molecular motor of muscle) in. nanotechnology. The review starts from the viewpoints of the molecular motors as being important devices responsible of cargo transportation in the cell and end in discussions about their employment in nanotechnological applications. First, we describe basic biophysics of the myosin motors with focus on their involvement in cargo transportation in the living cell, leading us over into a discussion about in vitro motility assays. These are biological test systems where the myosin-induced translocation of actin filaments is studied on an artificial surface outside the cell. Then follows a review about modified motility assays for production of ordered motion. Here, we discuss ours and others' work with regards to making micro- and nanostructured surfaces and channels where the position and direction of movement produced by molecular motors is controlled. In this section, we consider the role of the channel size in promoting unidirectional myosin-induced motion of actin filaments. Furthermore, we consider the usefulness of surface modifications, e.g., various silanization procedures in order to promote and hinder molecular motility, respectively. Particularly, we describe our latest test system being both morphologically and chemically nanostructured giving us unsurpassed possibilities to perform functional studies as well as extremely good spatio-temporal control. Then follows a section about nanotechnological cargo transportation systems based on the actomyosin motor system. For instance, we present results of attaching fluorescent quantum dots as cargoes to the actin filaments. In this section, we also discuss the possibilities of having cargo attachment and detachment being performed on demand. Finally, we consider the usefulness of molecular motors for lab-on-a-chip applications and the requirements for incorporating these motors in commercially viable devices. In this context, the significant potential of the actomyosin motor system to overcome traditional limitations of micro- and nanofluidics is stressed.
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| 7. |
- Norberg, Gunnar, et al.
(författare)
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Elastomer Chip Sockets for Reduced Thermal Mismatch Problems and Effortless Chip Replacement, Preliminary Investigations
- 2003
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 26:1, s. 33-40
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Tidskriftsartikel (refereegranskat)abstract
- To avoid the problem with thermo-mechanical stress induced fatigue using conventional flip-chip mounting of bare chips, an elastic chip socket has been developed. The socket is made by casting silicone elastomer into micro structured silicon molds to form micro bump arrays. After the elastomer is cured and released from the mold, a metal layer is deposited and patterned. A chip is placed in the socket utilizing guiding structures for chip self alignment. The chip is then held in place by a spring loaded back-plate which can also serve as a heat sink for highly effective chip cooling. Since no adhesives, underfills or solders are used, the rework process becomes very simple and it can also be repeated many times for the same socket. Initial contact resistance and thermo-mechanical robustness measurements indicates that this type of sockets could work as a superior replacement for conventional flip-chip technologies in many applications. The particular design of the contact bumps results in metal structures that resemble (although up side down) and are scalable as those in the Chip-First technology. Preliminary thermal shock experiments from room temperature to liquid nitrogen and back show good survival. Thus, this new chip interconnect method indicates the possibility of getting the advantages of the Chip-First technology while eliminating the demand of placing the chip first. The concept will work for chips with rim positioned pads as well as for high density area arrays.
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| 8. |
- Serban, Adriana, 1954-, et al.
(författare)
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Compontent Tolerance Effect on Ultra-Wideband Low-Noise Amplifier Performance
- 2010
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Ingår i: IEEE Transactions on Advanced Packaging. - : IEEE. - 1521-3323 .- 1557-9980. ; 33:3, s. 660-668
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Tidskriftsartikel (refereegranskat)abstract
- A study of the component tolerances on an ultra-wideband low-noise amplifier designed on a conventional printed circuit board is presented in this paper. The low-noise amplifier design employs dual-section input and output microstrip matching networks for wideband operation with a low noise figure and a flat power gain. Firstly, the effect of passive component and manufacturing process tolerances on the low-noise amplifier performance is theoretically studied by means of sensitivity analyses. Secondly, simulation and measurement results are presented for verification of the analytical results. It is shown that, compared with a lumped matching network design, a microstrip matching network design significantly reduces the ultra-wideband low-noise amplifier sensitivity to component tolerances.
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| 9. |
- Svensson, Christer, 1941-, et al.
(författare)
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Time domain modeling of lossy interconnects
- 2001
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Ingår i: IEEE Transactions on Advanced Packaging. - : Institute of Electrical and Electronics Engineers (IEEE). - 1521-3323 .- 1557-9980. ; 24:2, s. 191-196
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Tidskriftsartikel (refereegranskat)abstract
- A new model for dielectric loss, suitable for time domain modeling of printed circuit boards, is proposed. The model is based on a physical relaxation model. Complete time domain modeling of skin effect and dielectric losses in FR-4 boards are demonstrated and experimentally verified. Finally, the developed model is used to predict that FR-4 boards are useful for data rates up to 10 Gb/s.
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| 10. |
- Uhlig, Steffen, et al.
(författare)
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Polymer optical interconnects - A scalable large-area panel processing approach
- 2006
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 29:1, s. 158-170
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Tidskriftsartikel (refereegranskat)abstract
- A flexible approach to producing optical interconnects on 609.6 * 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 * 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6 * 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: = 50 µm * 10 µm) with refractive index step between core and cladding ?n = 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability. © 2006 IEEE.
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