| 1. |
- Akbari, Saeed, et al.
(författare)
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Ceramic Additive Manufacturing Potential for Power Electronics Packaging
- 2022
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Ingår i: IEEE Transactions on Components, Packaging, and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers Inc.. - 2156-3950 .- 2156-3985. ; 12:11, s. 1857-1866
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Tidskriftsartikel (refereegranskat)abstract
- Compared with silicon-based power devices, wide band gap (WBG) semiconductor devices operate at significantly higher power densities required in applications such as electric vehicles and more electric airplanes. This necessitates development of power electronics packages with enhanced thermal characteristics that fulfil the electrical insulation requirements. The present research investigates the feasibility of using ceramic additive manufacturing (AM), also known as three-dimensional (3D) printing, to address thermal and electrical requirements in packaging gallium nitride (GaN) based high-electron-mobility transistors (HEMTs). The goal is to exploit design freedom and manufacturing flexibility provided by ceramic AM to fabricate power device packages with a lower junction-to-ambient thermal resistance (RθJA). Ceramic AM also enables incorporation of intricate 3D features into the package structure in order to control the isolation distance between the package source and drain contact pads. Moreover, AM allows to fabricate different parts of the packaging assembly as a single structure to avoid high thermal resistance interfaces. For example, the ceramic package and the ceramic heatsink can be printed as a single part without any bonding layer. Thermal simulations under different thermal loading and cooling conditions show the improvement of thermal performance of the package fabricated by ceramic AM. If assisted by an efficient cooling strategy, the proposed package has the potential to reduce RθJA by up to 48%. The results of the preliminary efforts to fabricate the ceramic package by AM are presented, and the challenges that have to be overcome for further development of this manufacturing method are recognized and discussed.
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| 2. |
- Alfonso Alos, Esperanza, 1979, et al.
(författare)
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Ka-Band Gap Waveguide Coupled-Resonator Filter for Radio Link Diplexer Application
- 2013
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-3985 .- 2156-3950. ; 3:5, s. 870-879
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Tidskriftsartikel (refereegranskat)abstract
- Gap waveguide technology represents an interesting alternative as low-loss, cost-effective, and high-performance transmission line and package of microwave and millimeter-wave systems. A Ka-band coupled-resonator filter for a radio link diplexer, which requires high selectivity to isolate transmit and receiving channels, is proposed and realized using gap waveguide technology. The band-pass filter, which has a central frequency of 37.37 GHz and a pass bandwidth of 560 MHz, is fabricated between two parallel metal plates, leaving an air gap between them. After milling one of the plates, silver-plating is applied on them. Measurements show a minimum in-band insertion loss of 1 dB and agree quite well with simulations.
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| 3. |
- Algaba Brazalez, Astrid, 1983, et al.
(författare)
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Improved Microstrip Filters Using PMC Packaging by Lid of Nails
- 2012
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 2:7, s. 1075-1084
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Tidskriftsartikel (refereegranskat)abstract
- This paper shows that microstrip filters perform like textbook examples when packaged with perfect magnetic conductor (PMC). A PMC is made as a pin surface or lid of nails, and this is used to package a microstrip parallel coupled line bandpass filter. Our measurements confirm that parallel plate, cavity modes, and radiation are suppressed. This paper also includes a study of the reasons for a frequency shift between the ideal PMC packaged case and the realized case.
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| 4. |
- Aljarosha, Alhassan, 1982, et al.
(författare)
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Silicon-Based IC-Waveguide Integration for Compact and High-Efficiency mm-Wave Spatial Power Combiners
- 2021
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 11:7, s. 1115-1121
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Tidskriftsartikel (refereegranskat)abstract
- A novel and compact millimeter-wave spatial power combiner is developed integrating a Silicon-based integrated circuit (IC) in a metal waveguide. As an initial step towards integrating a silicon-based active IC in a waveguide, a passive back-to-back transition incorporating a 4-way spatial power splitter and combiner is realized at E-band (71–86 GHz). In contrast to existing solutions, the proposed design considers power splitting and combining using a low-loss wireless transition between the IC and the waveguide. The proposed back-to-back structure comprises an IC implemented using Institute for High Performance Microelectronics (IHP’s) 0.13μm SiGe BiCMOS technology integrated into the H-plane of a waveguide. The IC is post-processed and assembled in the waveguide prototype. The measured prototype shows a return loss better than 13 dB, an average insertion loss of 1.7 dB for a single transition, and a fractional bandwidth of 26.4 % (69–90 GHz).
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| 5. |
- Andersson, Henrik, et al.
(författare)
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Soldering Surface Mount Components onto Inkjet Printed Conductors on Paper Substrate using Industrial Processes
- 2016
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Ingår i: IEEE Transactions on Components, Packaging, and Manufacturing Technology. - 2156-3950 .- 2156-3985. ; 6:3, s. 478-485
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Tidskriftsartikel (refereegranskat)abstract
- This paper describes mounting of standard surface mount component packages on a paper substrate using an industrial solder process with a low-temperature solder. The use of paper as a substrate for printed flexible electronics is becoming more and more widespread as an alternative to the more commonly used plastic substrates, such as polyethylene and polyimide. Paper has the benefits of being environmentally friendly, recyclable, and renewable, as well as inexpensive. It is shown that it is possible to mount standard surface mount device components on paper substrates using low-temperature solder in an industrial soldering process. The contact resistances obtained are mostly low, although the yield of functioning contacts is low. The reason is cracking of the substrate coating layer that goes through the printed silver tracks. It was observed that the cracks appear mostly close to the contact pads, the most likely cause is thermal mismatch between the coating layer and solder and also thermal expansion of the photo paper resin coating. The smallest component package size, 0201, resulted in the highest yield of >80% with decreasing yield for larger package sizes.
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| 6. |
- Bleiker, Simon J., et al.
(författare)
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High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires
- 2015
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Ingår i: IEEE Transactions on Components, Packaging, and Manufacturing Technology. - : IEEE Press. - 2156-3950 .- 2156-3985. ; 5:1, s. 21-27
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Tidskriftsartikel (refereegranskat)abstract
- In this paper, we demonstrate a novel manufacturing technology for high-aspect-ratio vertical interconnects for high-frequency applications. This novel approach is based on magnetic self-assembly of prefabricated nickel wires that are subsequently insulated with a thermosetting polymer. The high-frequency performance of the through silicon vias (TSVs) is enhanced by depositing a gold layer on the outer surface of the nickel wires and by reducing capacitive parasitics through a low-k polymer liner. As compared with conventional TSV designs, this novel concept offers a more compact design and a simpler, potentially more cost-effective manufacturing process. Moreover, this fabrication concept is very versatile and adaptable to many different applications, such as interposer, micro electromechanical systems, or millimeter wave applications. For evaluation purposes, coplanar waveguides with incorporated TSV interconnections were fabricated and characterized. The experimental results reveal a high bandwidth from dc to 86 GHz and an insertion loss of <0.53 dB per single TSV interconnection for frequencies up to 75 GHz.
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| 7. |
- Chen, Si, 1981, et al.
(författare)
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Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
- 2015
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-3985 .- 2156-3950. ; 5:8, s. 1186-1196
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Tidskriftsartikel (refereegranskat)abstract
- Nanocomposite solders are regarded as one of the most promising interconnect materials for the high-density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. The compatibility issue will lead to a huge loss of nanoparticles from the solder matrix after the reflow soldering process. The thermal fatigue resistance of solder joint will also become degraded. Therefore, aiming to solve this problem, a novel nanocomposite solder consisting of Bi2Te3 semiconductor nanoparticles and Sn-3.0Ag-0.5Cu (SAC305) solder is presented. The effect of nanoparticles on the viscosity of solder paste and the void content of solder bump was first studied. Then, a series of analysis on the composition and microstructure of the solder bump were completed using transmission electron microscopy, X-ray diffraction, inductively coupled plasma-mass spectrometry, scanning electron microscopy, and energy dispersive X-ray spectroscopy. The survival rate of nanoparticles in the solder bump after reflow soldering process reaches as high as 80%. The refined microstructure was observed from the cross section of the nanocomposite solders. The shear test showed that the average mechanical strength of SAC305 solder after the addition of Bi2Te3 nanoparticles was higher. Meanwhile, no thermal fatigue resistance degradation was detected in the nanocomposite solder after 1000 thermal cycles in the range of -40 degrees C to 115 degrees C.
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| 8. |
- Divinyi, Andreas, et al.
(författare)
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On-Chip Sensors for Temperature Monitoring of Packaged GaN MMICs
- 2024
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 14:5, s. 891-896
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Tidskriftsartikel (refereegranskat)abstract
- A novel approach to on-chip temperature sensors for non-invasive thermal characterization and monitoring of packaged GaN MMICs is presented. The proposed sensor is fully compatible with commercial GaN foundry processes and enables improved reliability estimation of highly integrated systems. A dedicated test structure is developed to demonstrate the capabilities of the sensor, and an accurate calibration method of its temperature response is proposed. This combination allows for continuous temperature monitoring during operation with electrical acquisition of temperature transients. The method also enables the thermal characterization of the device and package.
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| 9. |
- Farjana, Sadia, 1983, et al.
(författare)
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Low Loss Gap Waveguide Transmission line and Transitions at 220-320 GHz Using Dry Film Micromachining
- 2021
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 11:11, s. 2012-2021
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents a novel microfabrication technique to manufacture gap waveguide components operating at sub-millimeter wave (sub-mmWave) frequency range. The conventional metal waveguide component manufacturing has a low resolution and low throughput and is not suitable for applications above 100 GHz. The micromachining techniques have matured and applied in various applications. Several micromachining techniques have been developed to address the specification requirements of different fields. Conventional micromachining techniques suffer from fabrication issues such as non-vertical sidewall, non-uniform surface, and time-consuming fabrication process. The proposed dry film photoresist offers significant amount of benefits such as fewer processing steps, reduced production cost, shorter prototyping time over existing micromachine techniques. To validate the proposed fabrication method, SUEX dry film photoresist is used to demonstrate three gap waveguide transmission lines. Different transitions from rectangular waveguide (RW) to gap waveguide (GW) have also been designed to characterize the newly fabricated gap waveguide components with a standard measurement setup. All the designed and fabricated device operates from 220 GHz to 320 GHz. The fabricated devices showed a good agreement with the simulation result over this frequency band and the measured average insertion losses were in the order of 0.048 dB/mm and 0.075 dB/mm for groove gap waveguide and ridge gap waveguide respectively. Thus, dry film photoresist provides fabrication precision of the structures and consequently opens the path for low-cost fabrication of high-frequency waveguide components.
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| 10. |
- Halonen, E., et al.
(författare)
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Oven sintering process optimization for inkjet-printed Ag Nanoparticle ink
- 2013
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Ingår i: IEEE Transactions on Components, Packaging, and Manufacturing Technology. - 2156-3950 .- 2156-3985. ; 3:2, s. 350-356
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Tidskriftsartikel (refereegranskat)abstract
- This paper focuses on optimizing the oven sintering time and temperature for inkjet-printed silver nanoparticle ink on a polyimide substrate. Two basic aspects in fabricating conductor structures in printable electronics are conductivity and adhesion between the ink and the substrate material. Conductivity evolution during oven sintering is monitored with real-time resistance measurements at five different temperatures. Based on conductivity results, adhesion is evaluated at several time points at three temperatures. The higher the sintering temperature, the faster the structures reach their maximum conductivity values. The lowest conductor resistivity values are below 4 μΩcm. However, at each sintering temperature, it takes longer to reach the best adhesion values. In this paper, we aim to better understand oven sintering of silver nanoparticles and determine the best oven sintering conditions (temperature, time) for our particular ink-substrate combination. The results can be used to further define optimum sintering conditions for printed nanoparticle inks on polymer substrates.
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