| 1. |
- Fu, Yifeng, 1984, et al.
(författare)
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Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
- 2016
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Ingår i: 2016 6th Electronic System-Integration Technology Conference (Estc). - 9781509014026 ; , s. Article no 7764713-
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Konferensbidrag (refereegranskat)abstract
- Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various post-growth processing of CNTs, such as doping, densification, transfer, metallization, etc., for the improvement of their performance will be reviewed.
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| 2. |
- Huang, Shirong, et al.
(författare)
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Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
- 2016
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Ingår i: 6th Electronic System-integration Technology Conference (ESTC 2016). - 9781509014026 ; , s. Article no 7764696-
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Konferensbidrag (refereegranskat)abstract
- Vertically-aligned multiwall carbon nanotubes were deposited on silicon substrate by low pressure chemical vapor deposition (LPCVD), which can be utilized as heat spreaders in high power electronic packaging due to their remarkable thermal conductivity. The infrared emissivity of the vertically aligned multiwall carbon nanotubes was then characterized based on the FLIR SC600 infrared imaging system. The average infrared emissivity of the multiwall carbon nanotubes sample was about 0.92, which agrees well with experimental results reported before. Scanning electron microscopy (SEM) images of the multiwall carbon nanotubes were further analyzed to explain its high emissivity, and the reason can be attributed to the homogeneous sparseness and aligned structure of the vertically aligned multiwall carbon nanotubes
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| 3. |
- Wang, Nan, 1988, et al.
(författare)
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Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
- 2016
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Ingår i: 2016 6th Electronic System-Integration Technology Conference (Estc). - 9781509014026 ; , s. Article no 7764682-
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Konferensbidrag (refereegranskat)abstract
- In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal management of power devices. The developed G-TCA has many advantages, including high thermal conductivity, lower density, good dispensing ability. and cost effective. To fabricate G-TCAs. few-layer graphene was utilized as fillers to improve the thermal conductivity of the TCA. The graphene nanosheets were fabricated through a high-speed shear mixing process in a mixed solvent. Compared to many reported liquid exfoliation process, the graphene fabrication process shows many advantages, such as high process efficiency, mass production, low-cost, clean and safe process. G-TCA sample with a hybrid filler ratio of 73% Ag and 3% graphene shows the highest thermal conductivity of 8 W/m K, which is almost four times higher than reference TCAs. A Joule heating setup was built to simulate G-TCA's function in a real electronic component and demonstrate the superior heat dissipation properties of the G-TCAs. Viscosities of the G-TCA samples were regulated in an acceptable range of many dispensing processes to be able to make uniform and fine patterns. Therefore, the developed G-TCA could be widely used for thermal management of power devices and electronic packaging area to decrease their working temperatures and extend the lifetime of devices.
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