| 1. |
- Belov, Ilja, et al.
(författare)
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Fin‐Tube and Plate Heat Exchangers : Evaluation of Transient Performance
- 2017
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Ingår i: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). - : IEEE. - 9781509043446 - 9781509043439 - 9781509043453
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Konferensbidrag (refereegranskat)abstract
- A methodology for evaluation of transient performance of, and comparison between plate heat exchanger and plate-fin-and-tube heat exchanger was developed and realized, including experiment and 3-D simulation. Heat transfer from water to a gas medium was addressed. The heated gas volume was the same for both heat exchanger designs. This was achieved by placing the plate-fin-and-tube heat exchanger into enclosure. The volume average temperature of the gas as function of time was computed. Estimated material cost for the studied designs was at least seven times lower than for the stainless steel plate heat exchanger. The performance of the selected plate-fin-and-tube heat exchanger design was found comparable to the plate heat exchanger, when both fin and tube materials were set to Al, and the enclosure was a light-weight thermal insulator. Transient behavior of the studied heat exchangers should be of interest for micro-grid applications, but also for thermal management in electronic cabinets and data centers.
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| 2. |
- Zhang, Yafan, et al.
(författare)
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Simulation-driven development of a novel SiC embedded power module design concept
- 2017
-
Ingår i: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. - : Institute of Electrical and Electronics Engineers (IEEE). - 9781509043446
-
Konferensbidrag (refereegranskat)abstract
- Silicon carbide embedded power modules enable a compact and cost competitive packaging solution for high-switching frequency and high-temperature operation applications. Power module packaging technologies span several engineering domains. At the early design stage, simulation-driven development is necessary to shorten the design period and reduce the design cost. This paper presents a novel design concept of a three-phase embedded power module (1200 V, 20 A, 55 mm × 36 mm × 0.808 mm) including silicon carbide metal-oxide-semiconductor field-effect transistor and antiparallel diode dies. Based on the E/CAD design data different layer built-up designs have been tested against thermal, mechanical, and electrical behavior. The obtained simulation data then have been evaluated against a commercial available power module (Motion Smart Power Module SMP33) which utilizes over mold direct bonded copper substrates with soldered semiconductor dies and bond wire contacts. Compared to the conventional module, the loop conductive interconnection parasitic inductance and resistance of the design concept (Vdc+ to Vdc-) reduces approximately by 88 % and 72 %, respectively. The average junction to case thermal resistance has been improved by approximately more than 10 % even though the total package size reduces by approximately 88 %. Furthermore, the contours of deformation and stresses have been investigated for the design concept in the thermomechanical simulation.
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