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Sökning: WFRF:(Aladov V A.)

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1.
  • Aladov, V ,A., et al. (författare)
  • A study of thermal regime in the high-power LED arrays
  • 2018
  • Ingår i: St. Petersburg Polytechnical University Journal: Physics and Mathematics. - : Polytechnical Univ Publishing House. - 2405-7223. ; 11:3, s. 39-51
  • Tidskriftsartikel (refereegranskat)abstract
    • Thermal resistance and temperature distribution for high-power AlGaInN LED chip-on-board arrays were measured by different methods and tools. The p-n junction temperature was determined through measuring a temperature-dependent forward voltage drop on the p-n junction, at a low measuring current after applying a high heating current. Furthermore, the infrared thermal imaging technique was employed to obtain the temperature map for the test object. A steady-state 3D computational model of the experimental setup was created including temperature-dependent power dissipation in the LED chips. Simulations of the heat transfer in the LED array were performed to further investigate temperature gradients observed in the measurements. Simulations revealed possible thermal deformation of the assembly as the reason for the hot spot formation. The bending of the assembly was confirmed by surface curvature measurements.
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2.
  • Chernyakov, A. E., et al. (författare)
  • Modeling of Temperature Distribution Induced by Thermo-Mechanical Deformation of High-Power AlInGaN LED Arrays
  • 2019
  • Ingår i: THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems. - : Institute of Electrical and Electronics Engineers Inc.. - 9781728120782
  • Konferensbidrag (refereegranskat)abstract
    • Thermo-mechanical deformation, thermal resistance, and lateral temperature distribution were experimentally studied for a high-power AlGaInN LED chip-on-board array at three different input powers. A fullscale CFD model of the LED assembly was developed and correlated with the temperature and average thermal resistance measurements to enable prediction of the temperature distribution on the surface of a thermally deformed LED assembly. Application of the thermal resistance partitioning approach to thermal modeling of the deformed LED assemblies was discussed. It can be useful for design engineers for estimation of the temperature distribution across the deformed LED array, at the minimum number of temperature measurements required for model calibration.
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  • Resultat 1-2 av 2
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konferensbidrag (1)
tidskriftsartikel (1)
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refereegranskat (2)
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Belov, Ilja (2)
Zakgeim, A. L. (2)
Chernyakov, A. E. (2)
Aladov, V ,A. (1)
Valyukhov, V. P. (1)
Aladov, A. V. (1)
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Belov, V. F. (1)
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Jönköping University (2)
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Engelska (2)
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