| 1. |
- Ahlberg, Eva-Lena, et al.
(author)
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Learning From Incident Reporting? : Analysis of Incidents Resulting in Patient Injuries in a Web-Based System in Swedish Health Care
- 2020
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In: Journal of patient safety. - : Wolters Kluwer. - 1549-8417 .- 1549-8425. ; 16:4, s. 264-268
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Journal article (peer-reviewed)abstract
- Objectives Incident reporting (IR) systems have the potential to improve patient safety if they enable learningfrom the reported risks and incidents. The aim of this study was to investigate incidents registered in an IR system in a Swedish county council.Methods The study was conducted in the County Council of Östergötland, Sweden. Data were retrieved from the IR system, which included 4755 incidents occurring in somatic care that resulted in patient injuries from 2004 to 2012. One hundred correctly classified patient injuries were randomly sampled from 3 injury severity levels: injuries leading to deaths, permanent harm, and temporary harm. Three aspects were analyzed: handling of the incident, causes of the incident, and actions taken to prevent its recurrence.Results Of the 300 injuries, 79% were handled in the departments where they occurred. The department head decided what actions should be taken to prevent recurrence in response to 95% of the injuries. A total of 448 causes were identified for the injuries; problems associated with procedures, routines, and guidelines were most common. Decisions taken for 80% of the injuries could be classified using the IR system documentation and root cause analysis. The most commonly pursued type of action was change of work routine or guideline.Conclusions The handling, causes, and actions taken to prevent recurrence were similar for injuries of different severity levels. Various forms of feedback (information, education, and dialogue) were an integral aspect of the IR system. However, this feedback was primarily intradepartmental and did not yield much organizational learning.
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| 4. |
- Andersson, Cristina, 1969, et al.
(author)
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Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints
- 2005
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In: 15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. ; 2005, s. 523-528
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Conference paper (peer-reviewed)abstract
- Temperature cycling of real electronic components was carried out in a systematic manner at two different temperature profiles and in a single-chamber Heraeus climate cabinet. The first temperature profile ranged between -55°C and 100°C and the second between 0°C and 100°C. Top-side SMD components (chip resistors and Ball Grid Arrays (BGA)) were soldered with Sn-3.8Ag-0.7Cu lead free solder paste. Crack initiation and propagation was analyzed after every 500 cycles for each temperature cycling profile. Totally, 6500 cycles were run at both temperature profiles. Finite element modeling (FEM) calculations, for the analysis of strain and stress of 1206 chip joints were used to corroborate the experimental work results, especially regarding the crack initiation sites. Cracks were firstly visible for the temperature cycling ranging between -55°C and 100°C. The cracks observed were also visibly smaller for the temperature profile ranging between 0°C and 100°C, concluding that crack initiation and propagation was slightly slower for this temperature profile. Cracks continued to propagate as a function of temperature cycles. The reason for this difference in crack initiation and propagation was also analyzed.
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| 5. |
- Andersson, Cristina, 1969, et al.
(author)
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Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints
- 2007
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In: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 47:2-3, s. 266-272
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Journal article (peer-reviewed)abstract
- Temperature cycling of a test board with different electronic components was carried out at two different temperature profiles in a single-chamber climate cabinet. The first temperature profile ranged between 55 and 100 C and the second between 0 and 100 C. Hole mounted components and secondary side SMD components were wave soldered with an Sn–3.5Ag alloy. Joints of both dual in line(DIL) packages and ceramic chip capacitors were investigated. Crack initiation and propagation was analysed after every 500 cycles.In total, 6500 cycles were run at both temperature profiles and the observations from each profile were compared.For both kinds of components analysed, cracks were first visible for the temperature profile ranging between 55 and 100 C. For this temperature profile, and for DIL packages, cracks were visible already after 500 cycles, whereas for the other temperature profile, cracks initiated between 1000 and 1500 cycles. The cracks observed after 1500 cycles were visibly smaller for the temperature profile ranging between 0 and 100 C, concluding that crack initiation and propagation was slightly slower for this temperature profile. For the chip capacitors, cracks were first visible after 2000 cycles.
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| 6. |
- Andersson, Cristina, 1969, et al.
(author)
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Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components
- 2008
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In: IEEE Transactions on Components and Packaging Technologies. - 1521-3331. ; 31:2, s. 331-344
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Journal article (peer-reviewed)abstract
- Temperature cycling of electronic components was carried out at two different temperature profiles, the first ranging between -55°C and 100°C (TC1) and the second between 0°C and 100°C (TC2). Totally, 7000 cycles were run at TC1 and 14500 cycles at TC2. The test board’s top-side components were surface mounted using Sn-3.8Ag-0.7Cu solder alloy, and bottom side SMD components were wave soldered with Sn-3.5Ag alloy. The solder joint degradation was investigated as a function of cycle number by means of shear strength measurements and cross-sectioning. The shear strength drop was correlated to both crack initiation time and propagation rate, and Microstructural changes. The effect of manufacturing process (reflow versus wave soldering) and component size (0805 versus 0603 components) on the shear strength were also investigated.For both reflow and wave soldered components, the harsher the test environment the faster and largest the decrease in shear strength. The shear force is higher for the 0805 components compared to the 0603. The effect of component size on the residual shear strength is higher for the testing condition TC1. TC1 also seems to have a higher effect on the residual shear strength compared to TC2. The main difference between wave soldered and reflow soldered components is that the shear strength is in average higher for the wave soldered components compared to the reflow soldered. For the reflow soldered components using SAC, the microstructure coarsens, especially the Ag3Sn intermetallic particles. Furthermore, this alloy shows an increase of the IMC layer (Cu-Ni-Sn) thickness, and the IMC layer growth is controlled by a diffusion mechanism. The IMC growth coefficient is for the SAC system tested at TC1 0.0231 μm/hr1/2 (0.00053μm/hr) and for TC2 0.0054 μm/hr1/2 (2.9*10-5μm/hr). The microstructural changes during thermal cycling are a result of both static and strain-enhanced aging. For the wave soldered components the microstructure also became coarser, however, the IMC layer (Ni3Sn4) thickness did not change.The IMC layer growth does not affect the shear strength for the test conditions applied in this work. The shear strength decrease observed in the present work as a result of thermal cycling is a result of both microstructural coarsening and crack propagation inside the solder joint.
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| 7. |
- Andersson, Cristina, 1969, et al.
(author)
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Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
- 2009
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In: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 21:2, s. 28-38
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Journal article (peer-reviewed)abstract
- Purpose - The purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead-free 388 plastic ball grid array (PBGA) packages and to deeply understand crack initiation and propagation.Design/methodology/approach - Temperature cycling of Sn-3.8Ag-0.7Cu PBGA packages was carried out at two temperature profiles, the first ranging between - 55 degrees C and 100 degrees C (TC1) and the second between 0 degrees C and 100 degrees C (TC2). Crack initiation and propagation was analyzed periodically and totally 7,000 cycles were run for TO and 14,500 for TC2. Finite element modeling (FEM), for the analysis of strain and stress, was used to corroborate the experimental results.Findings - The paper finds that TC1 had a characteristic life of 5,415 cycles and TC2 of 14,094 cycles, resulting in an acceleration factor of 2.6 between both profiles. Cracks were first visible for TC1, after 2,500 cycles, and only after 4,000 cycles for TC2. The crack propagation rate was faster for TC1 compared to TC2, and faster at the package side compared to the substrate side. The difference in crack propagation rate between the package side and substrate side was much larger for TC1 compared to TC2. Cracks developed first at the package side, and were also larger compared to the substrate side. The Cu tracks on the substrate side affected the crack propagation sites and behaved as SMD. All cracks propagated through the solder and crack propagation was mainly intergranular. Crack propagation was very random and did not follow the distance to neutral point (DNP) theory. FEM corroborated the experimental results, showing both the same critical location of highest creep strain and the independence of DNP.Originality/value - Such extensive work on the reliability assessment of Pb-free 388 PBGA packages has never been performed. This work also corroborates the results from other studies showing the difference in behavior between Pb-free and Pb-containing alloys.
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| 8. |
- Fornander, Elin, et al.
(author)
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Identifying mobility in populations with mixed marine/terrestrial diets : strontium isotope analysis of skeletal material from a passage grave in Resmo, Öland, Sweden
- 2015
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In: Forging identities. - Oxford : British Archaeological Reports. - 9781407314334 ; , s. 183-192, s. 183-192
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Book chapter (peer-reviewed)abstract
- Strontium isotope analysis of skeletal material as a means to reconstruct prehistoric residential patterns has previously mainly been applied to populations with terrestrial diets. Here we present a model for populations with mixed marine/terrestrial diets, which is based on two-component mixing of strontium isotopes. Applying this model, we can estimate the original strontium isotope value of the terrestrial component of the diet. Accordingly it is possible to identify non-local individuals even if they had a mixed marine/terrestrial diet. The model is applied to tooth enamel samples representing nine individuals recovered from a passage grave in Resmo, on the island of Öland in the Baltic Sea, where at least five non-local individuals, representing at least two different geographical regions of origin, were identified. Non-local individuals were more frequent during the Bronze Age than during previous phases.
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| 9. |
- Malinovschi, Andrei, 1978-, et al.
(author)
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Consequences of Using Post- or Prebronchodilator Reference Values in Interpreting Spirometry
- 2023
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In: American Journal of Respiratory and Critical Care Medicine. - : American Thoracic Society. - 1073-449X .- 1535-4970. ; 208:4, s. 461-471
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Journal article (peer-reviewed)abstract
- RATIONALE: Post-bronchodilator (BD) spirometry is used for diagnosis of chronic obstructive pulmonary disease (COPD). However, pre-BD reference values are used for spirometry interpretation.OBJECTIVES: To compare the resulting prevalence rates of abnormal spirometry and study the consequences of using pre- or post-BD reference values generated within the Swedish CArdioPulmonary bioImage Study (SCAPIS) when interpreting post-BD spirometry in a general population.METHODS: SCAPIS reference values for post-BD and pre-BD spirometry were based on 10,156 and 1,498 never-smoking, healthy participants, respectively. We studied the associations of abnormal spirometry, defined by using pre- or post-BD reference values, with respiratory burden in the SCAPIS general population (28,851 individuals).MEASUREMENTS AND MAIN RESULTS: Bronchodilation resulted in higher predicted median and lower limit of normal (LLN) for FEV1/FVC ratio. The prevalence of post-BD FEV1/FVC < pre-bronchodilator LLN was 4.8% and that of post-BD FEV1/FVC < post-bronchodilator LLN was 9.9% for the general population. An additional 5.1% was identified as having an abnormal post-BD FEV1/FVC ratio and this group had more respiratory symptoms, emphysema (13.5% vs. 4.1%, p<0.001) and self-reported physician-diagnosed COPD (2.8% vs. 0.5%, p<0.001) than subjects with post-BD FEV1/FVC ratio > LLN for both pre- and post-bronchodilation).CONCLUSIONS: Pre- and post-bronchodilator spirometry reference values differ with regard to FEV1/FVC ratio. Use of post-bronchodilator reference values doubled the population prevalence of airflow obstruction; this was related to a higher respiratory burden. Using post-bronchodilator reference values when interpreting post-bronchodilator spirometry might enable identification of individuals with mild disease and be clinically relevant.
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