| 1. |
- Backes, Claudia, et al.
(författare)
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Production and processing of graphene and related materials
- 2020
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Ingår i: 2D Materials. - : IOP Publishing. - 2053-1583. ; 7:2
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Tidskriftsartikel (refereegranskat)abstract
- We present an overview of the main techniques for production and processing of graphene and related materials (GRMs), as well as the key characterization procedures. We adopt a 'hands-on' approach, providing practical details and procedures as derived from literature as well as from the authors' experience, in order to enable the reader to reproduce the results. Section I is devoted to 'bottom up' approaches, whereby individual constituents are pieced together into more complex structures. We consider graphene nanoribbons (GNRs) produced either by solution processing or by on-surface synthesis in ultra high vacuum (UHV), as well carbon nanomembranes (CNM). Production of a variety of GNRs with tailored band gaps and edge shapes is now possible. CNMs can be tuned in terms of porosity, crystallinity and electronic behaviour. Section II covers 'top down' techniques. These rely on breaking down of a layered precursor, in the graphene case usually natural crystals like graphite or artificially synthesized materials, such as highly oriented pyrolythic graphite, monolayers or few layers (FL) flakes. The main focus of this section is on various exfoliation techniques in a liquid media, either intercalation or liquid phase exfoliation (LPE). The choice of precursor, exfoliation method, medium as well as the control of parameters such as time or temperature are crucial. A definite choice of parameters and conditions yields a particular material with specific properties that makes it more suitable for a targeted application. We cover protocols for the graphitic precursors to graphene oxide (GO). This is an important material for a range of applications in biomedicine, energy storage, nanocomposites, etc. Hummers' and modified Hummers' methods are used to make GO that subsequently can be reduced to obtain reduced graphene oxide (RGO) with a variety of strategies. GO flakes are also employed to prepare three-dimensional (3d) low density structures, such as sponges, foams, hydro- or aerogels. The assembly of flakes into 3d structures can provide improved mechanical properties. Aerogels with a highly open structure, with interconnected hierarchical pores, can enhance the accessibility to the whole surface area, as relevant for a number of applications, such as energy storage. The main recipes to yield graphite intercalation compounds (GICs) are also discussed. GICs are suitable precursors for covalent functionalization of graphene, but can also be used for the synthesis of uncharged graphene in solution. Degradation of the molecules intercalated in GICs can be triggered by high temperature treatment or microwave irradiation, creating a gas pressure surge in graphite and exfoliation. Electrochemical exfoliation by applying a voltage in an electrolyte to a graphite electrode can be tuned by varying precursors, electrolytes and potential. Graphite electrodes can be either negatively or positively intercalated to obtain GICs that are subsequently exfoliated. We also discuss the materials that can be amenable to exfoliation, by employing a theoretical data-mining approach. The exfoliation of LMs usually results in a heterogeneous dispersion of flakes with different lateral size and thickness. This is a critical bottleneck for applications, and hinders the full exploitation of GRMs produced by solution processing. The establishment of procedures to control the morphological properties of exfoliated GRMs, which also need to be industrially scalable, is one of the key needs. Section III deals with the processing of flakes. (Ultra)centrifugation techniques have thus far been the most investigated to sort GRMs following ultrasonication, shear mixing, ball milling, microfluidization, and wet-jet milling. It allows sorting by size and thickness. Inks formulated from GRM dispersions can be printed using a number of processes, from inkjet to screen printing. Each technique has specific rheological requirements, as well as geometrical constraints. The solvent choice is critical, not only for the GRM stability, but also in terms of optimizing printing on different substrates, such as glass, Si, plastic, paper, etc, all with different surface energies. Chemical modifications of such substrates is also a key step. Sections IV-VII are devoted to the growth of GRMs on various substrates and their processing after growth to place them on the surface of choice for specific applications. The substrate for graphene growth is a key determinant of the nature and quality of the resultant film. The lattice mismatch between graphene and substrate influences the resulting crystallinity. Growth on insulators, such as SiO2, typically results in films with small crystallites, whereas growth on the close-packed surfaces of metals yields highly crystalline films. Section IV outlines the growth of graphene on SiC substrates. This satisfies the requirements for electronic applications, with well-defined graphene-substrate interface, low trapped impurities and no need for transfer. It also allows graphene structures and devices to be measured directly on the growth substrate. The flatness of the substrate results in graphene with minimal strain and ripples on large areas, allowing spectroscopies and surface science to be performed. We also discuss the surface engineering by intercalation of the resulting graphene, its integration with Si-wafers and the production of nanostructures with the desired shape, with no need for patterning. Section V deals with chemical vapour deposition (CVD) onto various transition metals and on insulators. Growth on Ni results in graphitized polycrystalline films. While the thickness of these films can be optimized by controlling the deposition parameters, such as the type of hydrocarbon precursor and temperature, it is difficult to attain single layer graphene (SLG) across large areas, owing to the simultaneous nucleation/growth and solution/precipitation mechanisms. The differing characteristics of polycrystalline Ni films facilitate the growth of graphitic layers at different rates, resulting in regions with differing numbers of graphitic layers. High-quality films can be grown on Cu. Cu is available in a variety of shapes and forms, such as foils, bulks, foams, thin films on other materials and powders, making it attractive for industrial production of large area graphene films. The push to use CVD graphene in applications has also triggered a research line for the direct growth on insulators. The quality of the resulting films is lower than possible to date on metals, but enough, in terms of transmittance and resistivity, for many applications as described in section V. Transfer technologies are the focus of section VI. CVD synthesis of graphene on metals and bottom up molecular approaches require SLG to be transferred to the final target substrates. To have technological impact, the advances in production of high-quality large-area CVD graphene must be commensurate with those on transfer and placement on the final substrates. This is a prerequisite for most applications, such as touch panels, anticorrosion coatings, transparent electrodes and gas sensors etc. New strategies have improved the transferred graphene quality, making CVD graphene a feasible option for CMOS foundries. Methods based on complete etching of the metal substrate in suitable etchants, typically iron chloride, ammonium persulfate, or hydrogen chloride although reliable, are time- and resource-consuming, with damage to graphene and production of metal and etchant residues. Electrochemical delamination in a low-concentration aqueous solution is an alternative. In this case metallic substrates can be reused. Dry transfer is less detrimental for the SLG quality, enabling a deterministic transfer. There is a large range of layered materials (LMs) beyond graphite. Only few of them have been already exfoliated and fully characterized. Section VII deals with the growth of some of these materials. Amongst them, h-BN, transition metal tri- and di-chalcogenides are of paramount importance. The growth of h-BN is at present considered essential for the development of graphene in (opto) electronic applications, as h-BN is ideal as capping layer or substrate. The interesting optical and electronic properties of TMDs also require the development of scalable methods for their production. Large scale growth using chemical/physical vapour deposition or thermal assisted conversion has been thus far limited to a small set, such as h-BN or some TMDs. Heterostructures could also be directly grown. Section VIII discusses advances in GRM functionalization. A broad range of organic molecules can be anchored to the sp(2) basal plane by reductive functionalization. Negatively charged graphene can be prepared in liquid phase (e.g. via intercalation chemistry or electrochemically) and can react with electrophiles. This can be achieved both in dispersion or on substrate. The functional groups of GO can be further derivatized. Graphene can also be noncovalently functionalized, in particular with polycyclic aromatic hydrocarbons that assemble on the sp(2) carbon network by pi-pi stacking. In the liquid phase, this can enhance the colloidal stability of SLG/FLG. Approaches to achieve noncovalent on-substrate functionalization are also discussed, which can chemically dope graphene. Research efforts to derivatize CNMs are also summarized, as well as novel routes to selectively address defect sites. In dispersion, edges are the most dominant defects and can be covalently modified. This enhances colloidal stability without modifying the graphene basal plane. Basal plane point defects can also be modified, passivated and healed in ultra-high vacuum. The decoration of graphene with metal nanoparticles (NPs) has also received considerable attention, as it allows to exploit synergistic effects between NPs and graphene. Decoration can be either achieved chemically or in the gas phase. All LMs,
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| 2. |
- Asad, Muhammad, 1986, et al.
(författare)
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Graphene field-effect transistors for high frequency applications
- 2018
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Ingår i: ; November 2018
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Konferensbidrag (refereegranskat)abstract
- Realization of competitive high frequency graphene field-effect transistors (GFETs) is hindered, in particular, by extrinsic scattering of charge carriers and relatively high contact resistance of the graphene-metal contacts, which are both defined by the quality of the corresponding graphene top interfaces [1]. In this work, we report on improved performance of GFETs fabricated using high quality chemical vapour deposition (CVD) graphene and modified technology steps. The modified processing flow starts with formation of the gate dielectric, which allows for preserving the high velocity of charge carriers, and, simultaneously, providing very low contact resistance. The transfer line method (TLM) analysis and fitting the GFET transfer characteristics (Fig. 1) both reveal very low specific width contact resistivity of the top contacts, down to 95 Ω⋅μm. Fitting shows also that the field-effect mobility in the GFETs can be up to 5000 cm2/(V⋅s). The measured (extrinsic) transit frequency (fT) and the maximum frequency of oscillation (fmax) are up to 35 GHz and 40 GHz, respectively, for GFETs with gate length Lg=0.5 μm (Fig. 2), which are highest among those reported so far for the GFETs with similar gate length and comparable with those of Si MOSFETs [2,3]. The dependencies of the fT and fmax on the gate length indicate that these GFETs are very promising for the scaling down and in particular for the development of power amplifiers operating in the mm-wave frequency range.
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| 3. |
- Asad, Muhammad, 1986, et al.
(författare)
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The dependence of the high-frequency performance of graphene field-effect transistors on channel transport properties
- 2020
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Ingår i: IEEE Journal of the Electron Devices Society. - 2168-6734. ; 8, s. 457-464
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Tidskriftsartikel (refereegranskat)abstract
- This paper addresses the high-frequency performance limitations of graphene field-effect transistors (GFETs) caused by material imperfections. To understand these limitations, we performed a comprehensive study of the relationship between the quality of graphene and surrounding materials and the high-frequency performance of GFETs fabricated on a silicon chip. We measured the transit frequency (fT) and the maximum frequency of oscillation (fmax) for a set of GFETs across the chip, and as a measure of the material quality, we chose low-field carrier mobility. The low-field mobility varied across the chip from 600 cm2/Vs to 2000 cm2/Vs, while the fT and fmax frequencies varied from 20 GHz to 37 GHz. The relationship between these frequencies and the low-field mobility was observed experimentally and explained using a methodology based on a small-signal equivalent circuit model with parameters extracted from the drain resistance model and the charge-carrier velocity saturation model. Sensitivity analysis clarified the effects of equivalent-circuit parameters on the fT and fmax frequencies. To improve the GFET high-frequency performance, the transconductance was the most critical parameter, which could be improved by increasing the charge-carrier saturation velocity by selecting adjacent dielectric materials with optical phonon energies higher than that of SiO2.
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| 4. |
- Bonmann, Marlene, 1988, et al.
(författare)
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Drain current saturation in graphene field-effect transistors at high fields
- 2018
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Development of competitive high frequency graphene field-effect transistors (GFETs) is hindered, first of all, by a zero-bandgap phenomenon in monolayer graphene, which prevents the drain current saturation and limits significantly the GFET power gain. An approach has been proposed to realise the drain current saturation in GFETs without a bandgap formation, but via velocity saturation of the charge carriers at high fields [1]. In this work, we report on the performance of GFETs fabricated using high quality CVD monolayer graphene and modified technology, which reduce the concentration of traps generating the charge carriers at high fields [2]. Fig. 1 shows typical output characteristics of GFETs with gate length of 0.5 μm. The drain current clearly reveals the saturation trends at high fields, which we associate with the saturation of the carrier velocity, see inset to Fig. 2 [2]. Fig. 2 shows typical measured (extrinsic) transit frequency (fT) and the maximum frequency of oscillation (fmax), which are characteristics of the current and power gain, respectively. Since fT and fmax are proportional to the carrier velocity, they reveal similar saturation behaviour. We analyse the saturation effects by applying the Fermi-Dirac carrier statistics. The fT and fmax are up to 34 GHz and 37 GHz, respectively, which are highest among those reported so far for the GFETs with similar gate length and comparable with those reported for Si MOSFETs [3].
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| 5. |
- Bonmann, Marlene, 1988, et al.
(författare)
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Effects of self-heating on fT and fmax performance of graphene field-effect transistors
- 2020
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Ingår i: IEEE Transactions on Electron Devices. - 1557-9646 .- 0018-9383. ; 67:3, s. 1277-1284
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Tidskriftsartikel (refereegranskat)abstract
- It has been shown that there can be a significant temperature increase in graphene field-effect transistors (GFETs) operating under high drain bias, which is required for power gain. However, the possible effects of self-heating on the high-frequency performance of GFETs have been weakly addressed so far. In this article, we report on an experimental and theoretical study of the effects of self-heating on dc and high-frequency performance of GFETs by introducing a method that allows accurate evaluation of the effective channel temperature of GFETs with a submicrometer gate length. In the method, theoretical expressions for the transit frequency (fT) and the maximum frequency of oscillation (fmax) based on the small-signal equivalent circuit parameters are used in combination with the models of the field- and temperature-dependent charge carrier concentration, velocity, and saturation velocity of GFETs. The thermal resistances found by our method are in good agreement with those obtained by the solution of the Laplace equation and by the method of thermo-sensitive electrical parameters. Our experiments and modeling indicate that the self-heating can significantly degrade the fT and fmax of GFETs at power densities above 1 mW/μm², from approximately 25 to 20 GHz. This article provides valuable insights for further development of GFETs, taking into account the self-heating effects on the high-frequency performance.
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| 6. |
- Bonmann, Marlene, 1988, et al.
(författare)
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Effects of self-heating on high-frequency performance of graphene field-effect transistors
- 2019
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- In this work, we study the effects of self-heating (Joule heating) on the performance of graphene field-effect transistors (GFETs) with high extrinsic transit frequency (ft) and maximum frequency of oscillation (fmax) [1]. It has been shown, that self-heating in the GFETs might be significant and lead to degradation of the output characteristics with potential effects on the ft and fmax [2,3,4]. Due to relatively short gate length of 0.5 μm in the GFETs, used in this work, the local channel temperature cannot be accurately estimated by means of the infrared microscopy. Therefore, we applied the method of thermosensitive electrical parameters [5]. In particular, we analysed the gate and drain currents in response to variations of the external heater temperature and dc power (Fig. 1). The analysis allows for estimation of the thermal resistance, which is, for GFETs on SiO2/Si substrates, approx. 2e4 K/W, and in good agreement with that calculated by the model based on the solution of Laplace’s equation [6]. In turn, the known thermal resistance allows for evaluation of the GFET channel self-heating temperature. Fig. 2 shows the fmax versus dc power (Pdiss) at different external heater temperatures. The self-heating temperature at Pdiss =10 mW is approx. 130 °C. The drop in the fmax at higher Pdiss can be fully explained by self-heating. Apparently, one can expect reduced self-heating effects in the GFETs on higher thermal conductive substrates as hBN or SiC.
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| 7. |
- Bonmann, Marlene, 1988, et al.
(författare)
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Graphene field-effect transistors with high extrinsic fT and fmax
- 2019
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Ingår i: IEEE Electron Device Letters. - 0741-3106 .- 1558-0563. ; 40:1, s. 131-134
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Tidskriftsartikel (refereegranskat)abstract
- In this work, we report on the performance of graphene field-effect transistors (GFETs) in which the extrinsic transit frequency (fT) and maximum frequency of oscillation (fmax) showed improved scaling behavior with respect to the gate length (Lg). This improvement was achieved by the use of high-quality graphene in combination with successful optimization of the GFET technology, where extreme low source/drain contact resistances were obtained together with reduced parasitic pad capacitances. GFETs with gate lengths ranging from 0.5 μm to 2 μm have been characterized, and extrinsic fT and fmax frequencies of up to 34 GHz and 37 GHz, respectively, were obtained for GFETs with the shortest gate lengths. Simulations based on a small-signal equivalent circuit model are in good agreement with the measured data. Extrapolation predicts extrinsic fT and fmax values of approximately 100 GHz at Lg=50 nm. Further optimization of the GFET technology enables fmax values above 100 GHz, which is suitable for many millimeter wave applications.
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| 8. |
- Feijoo, Pedro C., et al.
(författare)
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Does carrier velocity saturation help to enhance fmax in graphene field-effect transistors?
- 2020
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Ingår i: Nanoscale Advances. - : Royal Society of Chemistry (RSC). - 2516-0230. ; 2:9, s. 4179-4186
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Tidskriftsartikel (refereegranskat)abstract
- It has been argued that current saturation in graphene field-effect transistors (GFETs) is needed to get optimal maximum oscillation frequency (f(max)). This paper investigates whether velocity saturation can help to get better current saturation and if that correlates with enhancedf(max). We have fabricated 500 nm GFETs with high extrinsicf(max)(37 GHz), and later simulated with a drift-diffusion model augmented with the relevant factors that influence carrier velocity, namely: short-channel electrostatics, saturation velocity effect, graphene/dielectric interface traps, and self-heating effects. Crucially, the model provides microscopic details of channel parameters such as carrier concentration, drift and saturation velocities, allowing us to correlate the observed macroscopic behavior with the local magnitudes. When biasing the GFET so all carriers in the channel are of the same sign resulting in highly concentrated unipolar channel, we find that the larger the drain bias is, both closer the carrier velocity to its saturation value and the higher thef(max)are. However, the highestf(max)can be achieved at biases where there exists a depletion of carriers near source or drain. In such a situation, the highestf(max)is not found in the velocity saturation regime, but where carrier velocity is far below its saturated value and the contribution of the diffusion mechanism to the current is comparable to the drift mechanism. The position and magnitude of the highestf(max)depend on the carrier concentration and total velocity, which are interdependent and are also affected by the self-heating. Importantly, this effect was found to severely limit radio-frequency performance, reducing the highestf(max)from similar to 60 to similar to 40 GHz.
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| 9. |
- Li, Junjie, 1995, et al.
(författare)
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High frequency noise characterisation of graphene field-effect transistors at different temperatures
- 2019
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Graphene is a promising material for high frequency electronics applications thanks to its intrinsically high carrier mobility and velocity, and graphene transistors are continuously pushed toward higher operating frequencies [1]. For high frequency low noise amplifiers, it is important to evaluate the noise parameters of the graphene field-effect transistors (GFETs). In this work, we present the noise performance of the GFETs made of chemical vapour deposition (CVD) in the frequency and temperature ranges of 2-18 GHz and -60-25 C. The noise figure with 50 Ohm impedance termination (F50) was measured using the cold-source method and then the minimum noise figure (Fmin) was estimated using the Pospieszalski’s noise model [2, 3]. In Fig. 1 and Fig. 2, the Fmin of a GFET with a gate length of 0.5 μm as a function of the frequency (f) and drain voltage (Vd) at different temperatures are shown. This GFET revealed maximum frequency of oscillation (fmax) of 18 and 21 GHz at 25 and -60 °C, respectively. It can be seen from Fig. 1, that the Fmin at 8 GHz is approx. 2 dB lower than that of the previously published CVD GFETs and comparable with that of the best published SiC GFETs [4, 5]. The Fmin decreases significantly with temperature down to 0.3 dB at 8 GHz, competing with Si CMOS [6]. It can be seen from Fig. 2, that Fmin decreases with the Vd and saturates above approx. 1 V, where GFETs operate in the velocity saturation mode [1]. Analysis of the dependences allows for further development of the GFETs for advanced low noise amplifiers.
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| 10. |
- Vorobiev, Andrei, 1963, et al.
(författare)
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Graphene Field-Effect Transistors for Millimeter Wave Amplifiers
- 2019
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Ingår i: International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz. - 2162-2027 .- 2162-2035. ; 2019-September
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Konferensbidrag (refereegranskat)abstract
- In this work, we analyze high frequency performance of graphene field-effect transistors (GFETs), applying models of drain resistance, carrier velocity and saturation velocity. This allows us to identify main limitations and propose an approach most promising for further development of the GFETs suitable for advanced mm-wave amplifiers. Analysis indicates, that the saturation velocity of charge carriers in the GFETs can be increased up to 5e7 cm/s via encapsulating graphene by hexagonal boron nitride layers, with corresponding increase of extrinsic maximum frequency of oscillation up to 180 GHz at 200 nm gate length.
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