| 1. |
- Fu, C., et al.
(författare)
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Optimization of stiffness for isotropic conductive adhesives
- 2010
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Ingår i: 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. - 9781424467563 ; , s. 29-33
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- With the rapid developments of electronic packaging, there is an increasing demand on high performance isotropic conductive adhesives (ICAs). However, the traditional ICAs are brittle, sensitive for crack formation and delamination, which is one of the major drawbacks that limits their use in a wide range of applications. Therefore great efforts have been made to make conductive adhesives more flexible. The present work aims at studying of several chemicals in terms of flexibilizing materials to modify the stiffuess modulus of the conductive adhesives. The effect of the flexibilizers has been characterized by different methods, such as Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA), Thermogravimetric Analysis (TGA), etc. Moreover, the electrical resistance, thermal conductivity and viscosity are also measured in various conditions. Experimental results indicate that one of the flexibilizing materials using flexible ester-linkage is particular of interest as it offers low electrical resistance, high thermal performance and low modulus without decreasing glass transition temperature (Tg) and influencing curing and decomposition conditions. ©2010 IEEE.
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| 2. |
- Tao, W., et al.
(författare)
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Reliability study for high temperature stable conductive adhesives
- 2010
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Ingår i: 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. - 9781424467563 ; , s. 74-77
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current conductive adhesives is easy to degrade during temperature and humidity aging. Therefore a high temperature stable matrix was developed for conductive adhesive fabrication. Based on this matrix, a kind of isotropic conductive adhesive (ICA) was fabricated in this work. The curing behavior of ICA was investigated by Differential Scanning Calorimeter (DSC). The properties such as glass transition temperature (Tg), storage modulus were detected by Dynamic Mechanical Analyzer (DMA). Thermogravimetric Analysis (TGA) was used to determine the decomposition behavior. The humidity test was subsequently carried out to evaluate moisture resistance of ICA. The electrical resistances of the ICA samples were measured by the multimeter. During humidity test, no obvious change of electrical resistance of ICA samples was observed. ©2010 IEEE.
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