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- Askarinejad, Amin, et al.
(författare)
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Physical modelling of rainfall induced landslides undercontrolled climatic conditions
- 2012
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Konferensbidrag (refereegranskat)abstract
- A series of small scale physical modelling tests are performed in a geotechnical drumcentrifuge in order to investigate the triggering mechanisms of landslides due to rainfall. They areconducted under controlled conditions of rainfall intensity and duration, ambient relative humidity, wind,and temperature. These tests have been designed to study the possible failure mechanisms proposed for afull scale landslide experiment. Accordingly, different shapes and hydraulic properties of the bedrock, interms of drainage and exfiltration, are provided for the model. A three dimensional close rangephotogrammetric technique is used to track the movements and monitor the volumetric changes of theground during the cycles of wetting and drying. The slope elevation is filmed during and following therainfall events using a high speed camera and the deformation vectors and strains are elaborated using thePIV method. Details of the design of the climate chamber are discussed in this paper.
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- Laakso, Miku J., et al.
(författare)
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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
- 2018
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Ingår i: IEEE Access. - : Institute of Electrical and Electronics Engineers (IEEE). - 2169-3536. ; 6, s. 44306-44317
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Tidskriftsartikel (refereegranskat)abstract
- A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.
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