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Sökning: WFRF:(Buchta R.)

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  • Blom, Hans-Olof, et al. (författare)
  • Removal of RSE induced damages in silicon
  • 1986
  • Ingår i: Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films. - 0734-2101 .- 1520-8559. ; 4:3, s. 752-
  • Tidskriftsartikel (refereegranskat)
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3.
  • Hammar, M., et al. (författare)
  • Investigation of chemically vapour deposited tungsten and tungsten silicide as contacts to n+ and p+ silicon areas
  • 1990
  • Ingår i: Thin Solid Films. - 0040-6090 .- 1879-2731. ; 185:1, s. 9-19
  • Tidskriftsartikel (refereegranskat)abstract
    • Tungsten and WSi2 have been examined as contact barriers between aluminium and n+ - or p+ -Si. The specific contact resistivity and diode leakage current were evaluated after heat treatment at different temperatures. Rutherford backscattering spectrometry measurements, X-ray diffraction analysis, scanning electron microscopy and sheet resistance measurements were performed to study the thermal stabilities of the Al/W/Si and Al/WSi2/Si systems. The contact resistivities of chemically vapour deposited tungsten and WSi2 to n+ -Si with a surface concentration of 7.5 × 1019 cm-3 were 8 × 10-7 Ωcm2 and 9 × 10-7 Ωcm2 respectively. To p+ -Si with a surface concentration of 2.6 × 1019 cm-3, they were 5 × 10-6 and 1 × 10-6 Ωcm2. Diffusion of aluminium was revealed to occur above 475°C in the case of tungsten and at 475°C in the case of WSi2. The void formation in silicon substrates was observed after heat treatment at 500°C for the Al/WSi2/Si system. The increase in leakage current for the Al/W/Si and Al/WSi2/Si structures is related to the onset of Si-Al interpenetration. Alloy formation was observed at 500°C for tungsten contacts whereas W-Al or other alloys were not detected up to 600°C for the WSi2 contact.
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