| 1. |
- Nylander, Andreas, 1988, et al.
(author)
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Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials
- 2018
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In: THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings.
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Conference paper (peer-reviewed)abstract
- Following Moores law, the development of electronics has led to an exponential increase of transistor density over the last couple of decades. Unfortunately, this trend also gives an increased heat power density in active components. Thermal interface materials (TIMs) are used to decrease the thermal resistance in thermal packages by filling out air gaps that naturally form there. TIMs are at the same time identified as a bottleneck due to their relatively low thermal conductivity. Carbon nanotubes (CNTs) are proposed as a future material for TIMs due to their high thermal conductivity and conformable nature. However, no reliability studies for CNT array TIMs can be found in literature that would demonstrate how these types of interfaces would perform. This is to the authors best knowledge the first reported study on thermal reliability for a CNT array TIM, which will be an important step towards a market realisation.
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| 2. |
- Ras, Mohammad Abo, et al.
(author)
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Design and realization of characterization demonstrator to investigate thermal performance of vertically-aligned carbon nanotubes TIM for avionics and aerospace applications
- 2017
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In: THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. ; 2017-January, s. 1-6
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Conference paper (peer-reviewed)abstract
- In the joint project SMARTHERM the applicability of vertically-aligned carbon nanotubes (VACNT) is main subject of interest. Target is the implementation of a VACNT layer as functional thermal interface material into an RF package to prove this promising technology's feasibility. This paper presents the approach the SMARTHERM consortium has taken so far. Beginning with a general motivation why to engage in this topic, the approach and the chosen demonstrator design are introduced. One focus lies on the description of the demonstrator and its components alongside with a comprehensive view into the assembling as main challenge. The choice of measurement techniques is discussed and the measures of success are defined. Finally, the results are presented, discussed and concluded and an outlook is provided how the findings influence further approaches in the project.
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| 3. |
- Wang, Nan, et al.
(author)
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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
- 2018
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In: 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781538663868 - 9781538663868 ; , s. 1588-1592
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Conference paper (peer-reviewed)abstract
- A light-weight, robust and highly thermal conductive copper/graphene film laminated structure was developed as novel heat spreading materials for thermal management applications. The advantages of the copper/graphene film laminated structure lie in its ability to combine both good mechanical properties of metals and excellent thermal properties of graphene film. Graphene films (GFs) were fabricated via self-assembly of graphene oxide (GO) sheets and post-treated by high temperature graphitization and mechanical pressing. The resulted GFs show excellent flexibility and greatly improved tensile strength which is over 3 times higher than commercial PGS. The successful lamination between copper and GFs was realized by indium bonding. Thin indium layers can provide complete physical contact between copper and GFs, and thereby, minimize the contact resistance induced by surface roughness. The measured contact thermal resistance between copper and GFs bonded by indium is in the range of 2-5 Kmm(2)/W for a working temperature between 20 degrees C to 100 degrees C. This value is orders magnitude lower than other bonding methods, including direct hot pressing of copper and GFs, tape bonding and thermal conductive adhesive (TCA) bonding. By tailoring the thickness of GFs, desirable laminated composites with optimized thermal conductivity can be obtained, which offers an efficient heat dissipation solution for power driven systems.
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