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| 2. |
- Amin, Yasar, et al.
(författare)
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SoP design on liquid crystal polymer substrate for 5 GHz RF receiver front-end module
- 2005
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Ingår i: International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005. - 9781604235722 ; , s. 236-240
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Konferensbidrag (refereegranskat)abstract
- Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents highdensity multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on liquid crystal polymer (LCP) substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.
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| 3. |
- Duo, Xinzhong, et al.
(författare)
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A concurrent multi-band LNA for multi-standard radios
- 2005
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Ingår i: 2005 IEEE International Symposium On Circuits And Systems (ISCAS), Conference Proceedings. - : IEEE. - 0780388348 ; , s. 3982-3985
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Konferensbidrag (refereegranskat)abstract
- A source-degenerated cascade LNA, which works at 2.4GHz and 5.8GHz simultaneously, is designed for Bluetooth and IEEE wireless LAN 802.11 a/b/g receivers. In this design, 0.15 mu m GaAs PHEMT technology and embedded passives in MCM-D substrate are implemented. At 2.4GHz and 5.8GHz, this LNA provides 12.2dB and 15.3dB gain, respectively. Noise figures of the LNA are 0.53dB and 1.43dB, respectively. Good input matching and output matching are also achieved-S11 and S22 at both frequencies are less than -10dB.
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| 4. |
- Duo, Xinzhong, et al.
(författare)
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A DC-13GHz LNA for UWB RFID applications
- 2004
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Ingår i: 22ND NORCHIP CONFERENCE, PROCEEDINGS. - 0780385101 ; , s. 241-244
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Konferensbidrag (refereegranskat)abstract
- In this paper, we present a 4-stage traveling wave lownoise amplifier for UWB RFID (ultra-wideband radiofrequency identification). This LNA covers a frequencyrange of DC - 13 CHz. The circuit is implemented with0.I5pm GaAs PHEMT chips embedded in flexible LCP(liquid crystal polymer) substrate. In the frequency range,the gain of the LNA is better than IO dB, fluctuation of thegain is less than 3dB, its noise figure is less than 4dB, SI 1and S22 are around -10 dB.
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| 5. |
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| 6. |
- Duo, Xinzhong, et al.
(författare)
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Analysis of lossy packaging parasitics for common emitter LNA in system-on-package
- 2004
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Ingår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. - NEW YORK : IEEE. - 0780386671 ; , s. 75-78
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Konferensbidrag (refereegranskat)abstract
- Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate performance of each solution. In this paper, analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. As well, influence of lossy packaging parasitics on LNA is also analyzed.
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| 7. |
- Duo, Xinzhong, et al.
(författare)
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Broadband CMOS LNAs for IR-UWB receiver
- 2005
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Ingår i: Norchip 2005, Proceedings. - New York : IEEE. - 1424400643 ; , s. 273-276
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Konferensbidrag (refereegranskat)abstract
- Two single-ended wideband LNAs for Ultrawide-band receiver have been designed and implemented in 0.18 mu m CMOS technology. The first one, a feed-back LNA, is a two-stage amplifier with a improved feedback loop, which provides high gain and enables the input port to match with 500 in a wide frequency range from 500MHz to 8GHz. The second one, an LC low-pass-filter matched LNA, employs a third-order low pass filter in the input port to match a frequency range from 3GHz to 8GHz. In both of the LNAs, the input stage is a common source amplifier. Inductive shunt peaking is used for maximizing the bandwidth and flatting the gain. In the feed-back LNA, measurements show that the maximum gain is 11.5dB, the 3-dB; bandwidth is from 500MHz to 7GHz, IIP3 is -2.2dBm at 4GHz, the minimum noise figure is around 5.7dB, S11 is less than 8.2dB, and the power consumption is 14mW. In the LC filter matched LNA, the 3-dB bandwidth is from 3GHz to 7.3GHz. The maximum gain is 9.6dB, IIP3 is 0dBm at 4 GHz, the minimum noise figure is 7.6dB, S11 is less than -13.4dB and the power consumption is 23mW.
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| 8. |
- Duo, Xinzhong, et al.
(författare)
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Chip-package co-design of common emitter LNA in system-on-package with on-chip versus off-chip passive component analysis
- 2003
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Ingår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. - NEW YORK : IEEE. ; , s. 55-58
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Konferensbidrag (refereegranskat)abstract
- In this paper, we present common emitter LNAs (low noise amplifiers) in system-on-package for 5GHz WLAN application. Innovation of this module is that it is chip-package co-designed and co-simulated with performance trade-offs for on-chip versus off-chip passive component integration. It thus provides an optimal total solution for embedded RF electronics in system-level integration. Analytical equations for key performance parameters, noise figure and gain, of these LNAs are developed as functions of quality factors of passive components and the package parasitics. They hence provide designers a quantitative trade-off for on-chip versus off-chip passive components integration in SoP design. The final module is composed of on-chip active components in 0.5mum SiGe BiCMOS technology and off-chip passive components integrated in MCM-D substrate. Significant improvement in performance is found in these co-designed LNAs than those in single-chip LNAs.
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| 9. |
- Duo, Xinzhong, et al.
(författare)
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Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology
- 2003
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Ingår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. - 0780381289 ; , s. 51-54
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Konferensbidrag (refereegranskat)abstract
- In this paper, we present a receiver front-end for 5 GHz wireless LAN in novel LCP (liquid crystal polymer) based system-on-package module. The module is based on embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. Furthermore, the novel LCP material shows excellent RF and microwave performance. The quality factors of key passive components such as inductors integrated in LCP substrate with thin film technologies is as high as 60. The insertion loss of the bandpass filter is 3dB. The conversion gain of the receiver front-end is 20 dB and occupies 8.7mm by 3.6mm area.
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